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SOIL: Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedde...
2024-07-16 - 2027-05-31 | Financiado

EdgeAI-Trust: Decentralized Edge Intelligence Advancing Trust Safety and Sustainability in Europe STMICROELECTRONICS ROUSSET SAS participó en un HORIZON EUROPE: HORIZON-KDT-JU-2023-1-IA EdgeAI-trust aims to develop a domain-independent architecture for decentralized edge AI along with HW/SW edge AI solutions and tools, which...
2024-06-27 - 2027-04-30 | Financiado

Ferro4EdgeAI: Scalable, ferroelectric based accelerators for energy efficient edge AI STMICROELECTRONICS ROUSSET SAS participó en un HORIZON EUROPE: HORIZON-CL4-2023-DIGITAL-EMERGING-01-CNECT The Ferro4EdgeAI project will provide an ultra-low power, scalable edge accelerator for artificial intelligence incorporating a memory augme...
2023-10-25 - 2027-12-31 | Financiado

NeuroSoC: A multiprocessor system on chip with in-memory neural processing unit STMICROELECTRONICS ROUSSET SAS participó en un HORIZON EUROPE: HORIZON-CL4-2021-DIGITAL-EMERGING-01 Deployment of intelligence at the edge presents many challenges because devices need to be low-cost and, as such, they are often constrained...
2022-06-20 - 2026-02-28 | Financiado

StorAIge: Embedded storage elements on next MCU generation ready for AI on the edge STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2020-1-IA-two-stage The main objective of the storAIge project is the development and industrialization of FDSOI 28nm and next generation embedded Phase Change...
2021-05-12 - 2024-10-31 | Financiado

GaN4AP: GaN for Advanced Power Applications STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2020-1-IA-two-stage GaN4AP project has the ambitious target of making the GaN-based electronics to become the main power active device present in all power conv...
2021-05-12 - 2025-08-31 | Financiado

InSecTT: Intelligent Secure Trustable Things STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage "Artificial Intelligence of Things (AIoT) is the natural evolution for both Artificial Intelligence (AI) and Internet of Things (IoT) becaus...
2020-05-20 - 2023-08-31 | Financiado

AVANGARD: Advanced manufacturing solutions tightly aligned with business needs STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-NMBP-TR-IND-2018-2020 The AVANGARD project addresses the integration of three novel processing units into an existing Microfactory test bed conceived to produce u...
2019-10-11 - 2022-10-14 | Financiado

MADEin4: Metrology Advances for Digitized ECS industry 4.0 STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado

OCEAN12: Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage OCEAN12 targets the key societal challenge of smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors...
2018-05-23 - 2022-09-30 | Financiado

WAKeMeUP: Wafers for Automotive and other Key applications using Memories embedded in Ulsi Processors STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufac...
2018-05-22 - 2021-08-31 | Financiado

3eFERRO: Energy Efficient Embedded Non volatile Memory Logic based on Ferroelectric Hf Zr O2 STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ICT-2016-2017 Edge computing requires highly energy efficient microprocessor units (MCU) with embedded non-volatile memories (eNVM) to process data at the...
2017-10-31 - 2021-06-30 | Financiado

Productive4.0: Electronics and ICT as enabler for digital industry and optimized supply chain management covering t... STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage PRODUCTIVE4.0 - AMBITIOUS PROJECT WITH A UNIQUE MAIN OBJECTIVE The main objective of Productive4.0 is to achieve improvement of digitising t...
2017-05-15 - 2020-10-31 | Financiado

ACTIVAGE: ACTivating InnoVative IoT smart living environments for AGEing well STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-IOT-2016-2017 ACTIVAGE is a European Multi Centric Large Scale Pilot on Smart Living Environments. The main objective is to build the first European IoT e...
2016-11-09 - 2020-09-30 | Financiado

PRIME: Ultra Low PoweR technologIes and MEmory architectures for IoT STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ECSEL-2015-1-RIA-two-stage-Master The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architec...
2016-05-04 - 2019-09-30 | Financiado

HECTOR: HARDWARE ENABLED CRYPTO AND RANDOMNESS STMICROELECTRONICS ROUSSET SAS participó en un H2020: H2020-ICT-2014 A single flipped bit or a weak random number generator can cause secure systems to fail. The main objective of this proposal is to close the...
2014-12-09 - 2018-07-31 | Financiado

INTEGRATE: Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs STMICROELECTRONICS ROUSSET SAS participó en un FP6: European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and prod...
2013-01-01 - 2015-12-31 | Financiado

TOISE: Trusted Computing for European Embedded devices STMICROELECTRONICS ROUSSET SAS participó en un FP6: For the future European applications such as Smart Grids for electricity network, smart low energy controlled home appliance, smart logistic...
2011-01-01 - 2013-12-01 | Financiado

ESIP: Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test STMICROELECTRONICS ROUSSET SAS participó en un FP6: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
2010-05-01 - 2013-04-01 | Financiado

IMPROVE: Implementing Manufacturing science solutions to increase equipment PrOductiVity and fab pErformance STMICROELECTRONICS ROUSSET SAS participó en un FP6: IMPROVE aims to improve European Semiconductor fabs efficiency by providing methods and tools to better control the process variability, red...
2009-03-01 - 2012-02-01 | Financiado

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