Innovating Works

ST ROUSSET

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Showing 1 to 20 of 25 results
SOIL: Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedde...
2024-07-16 - 2027-05-31 | Financiado
EdgeAI-Trust: Decentralized Edge Intelligence Advancing Trust Safety and Sustainability in Europe STMICROELECTRONICS ROUSSET SAS participó en un HORIZON EUROPE HORIZON-KDT-JU-2023-1-IA EdgeAI-trust aims to develop a domain-independent architecture for decentralized edge AI along with HW/SW edge AI solutions and tools, which...
2024-06-27 - 2027-04-30 | Financiado
Ferro4EdgeAI: Scalable, ferroelectric based accelerators for energy efficient edge AI STMICROELECTRONICS ROUSSET SAS participó en un HORIZON EUROPE HORIZON-CL4-2023-DIGITAL-EMERGING-01-CNECT The Ferro4EdgeAI project will provide an ultra-low power, scalable edge accelerator for artificial intelligence incorporating a memory augme...
2023-10-25 - 2027-12-31 | Financiado
NeuroSoC: A multiprocessor system on chip with in-memory neural processing unit STMICROELECTRONICS ROUSSET SAS participó en un HORIZON EUROPE HORIZON-CL4-2021-DIGITAL-EMERGING-01 Deployment of intelligence at the edge presents many challenges because devices need to be low-cost and, as such, they are often constrained...
2022-06-20 - 2026-02-28 | Financiado
StorAIge: Embedded storage elements on next MCU generation ready for AI on the edge STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2020-1-IA-two-stage The main objective of the storAIge project is the development and industrialization of FDSOI 28nm and next generation embedded Phase Change...
2021-05-12 - 2024-10-31 | Financiado
GaN4AP: GaN for Advanced Power Applications STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2020-1-IA-two-stage GaN4AP project has the ambitious target of making the GaN-based electronics to become the main power active device present in all power conv...
2021-05-12 - 2025-08-31 | Financiado
InSecTT: Intelligent Secure Trustable Things STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2019-1-IA-two-stage "Artificial Intelligence of Things (AIoT) is the natural evolution for both Artificial Intelligence (AI) and Internet of Things (IoT) becaus...
2020-05-20 - 2023-08-31 | Financiado
AVANGARD: Advanced manufacturing solutions tightly aligned with business needs STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-NMBP-TR-IND-2018-2020 The AVANGARD project addresses the integration of three novel processing units into an existing Microfactory test bed conceived to produce u...
2019-10-11 - 2022-10-14 | Financiado
MADEin4: Metrology Advances for Digitized ECS industry 4.0 STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado
OCEAN12: Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage OCEAN12 targets the key societal challenge of smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors...
2018-05-23 - 2022-09-30 | Financiado
WAKeMeUP: Wafers for Automotive and other Key applications using Memories embedded in Ulsi Processors STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufac...
2018-05-22 - 2021-08-31 | Financiado
3eFERRO: Energy Efficient Embedded Non volatile Memory Logic based on Ferroelectric Hf Zr O2 STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ICT-2016-2017 Edge computing requires highly energy efficient microprocessor units (MCU) with embedded non-volatile memories (eNVM) to process data at the...
2017-10-31 - 2021-06-30 | Financiado
Productive4.0: Electronics and ICT as enabler for digital industry and optimized supply chain management covering t... STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2016-2-IA-two-stage PRODUCTIVE4.0 - AMBITIOUS PROJECT WITH A UNIQUE MAIN OBJECTIVE The main objective of Productive4.0 is to achieve improvement of digitising t...
2017-05-15 - 2020-10-31 | Financiado
ACTIVAGE: ACTivating InnoVative IoT smart living environments for AGEing well STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-IOT-2016-2017 ACTIVAGE is a European Multi Centric Large Scale Pilot on Smart Living Environments. The main objective is to build the first European IoT e...
2016-11-09 - 2020-09-30 | Financiado
PRIME: Ultra Low PoweR technologIes and MEmory architectures for IoT STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ECSEL-2015-1-RIA-two-stage-Master The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architec...
2016-05-04 - 2019-09-30 | Financiado
HECTOR: HARDWARE ENABLED CRYPTO AND RANDOMNESS STMICROELECTRONICS ROUSSET SAS participó en un H2020 H2020-ICT-2014 A single flipped bit or a weak random number generator can cause secure systems to fail. The main objective of this proposal is to close the...
2014-12-09 - 2018-07-31 | Financiado
INTEGRATE: Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs STMICROELECTRONICS ROUSSET SAS participó en un FP6 European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and prod...
2013-01-01 - 2015-12-31 | Financiado
TOISE: Trusted Computing for European Embedded devices STMICROELECTRONICS ROUSSET SAS participó en un FP6 For the future European applications such as Smart Grids for electricity network, smart low energy controlled home appliance, smart logistic...
2011-01-01 - 2013-12-01 | Financiado
ESIP: Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test STMICROELECTRONICS ROUSSET SAS participó en un FP6 The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
2010-05-01 - 2013-04-01 | Financiado
IMPROVE: Implementing Manufacturing science solutions to increase equipment PrOductiVity and fab pErformance STMICROELECTRONICS ROUSSET SAS participó en un FP6 IMPROVE aims to improve European Semiconductor fabs efficiency by providing methods and tools to better control the process variability, red...
2009-03-01 - 2012-02-01 | Financiado
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