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WAKeMeUP

Financiado

Cerrado

Wafers for Automotive and other Key applications using Memories embedded in Uls...

Wafers for Automotive and other Key applications using Memories embedded in Ulsi Processors The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart soc... ver más

31/08/2021

STM CROLLES

95M€

Presupuesto del proyecto: 95M€

Líder del proyecto

STMICROELECTRONICS CROLLES 2 SAS No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 20 Participantes

Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2021-08-31

ECSEL-2017-1: IA Scope:An ECSEL Innovation Action (IA) primarily consists of activities aiming at pilot lines, test b...

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Características del participante

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

20 Participantes

STM CROLLES

8.31M€ | Lider

CONTINENTAL TEVES

257.25K€ | Participante

X-FAB FRANCE

15.75K€ | Participante

UGA

419.03K€ | Participante

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Duración del proyecto: 39 meses Fecha Inicio: 2018-05-22
Fecha Fin: 2021-08-31

Líder del proyecto

STMICROELECTRONICS CROLLES 2 SAS No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 95M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains. The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, hard security on the same chip. The project will also target the industrialization of the embedded Phase Change Memory (PCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption. The alternative memory solutions will be also studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories. To achieve this goal of generating high value added semiconductor circuits in Europe in a breakthrough leading edge technology the project will deploy all the necessary activities to bring a new technology to an early industrial maturity stage. These activities encompass such developments as: technology enhancements for various specific application requirements such as wide temperature range and reliability, high security requests, high flexibility…, design enablment allowing first time silicon success, prototyping demonstrator products in the different application areas. In the WAKEMEUP project, new devices and systems will be developed by the application partners in automotive and secure based on FD-SOI and embedded digital technology to answer specific applications needs.

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