Innovating Works

RECIF

Desconocido
10ACe: 10 Angstrom CMOS exploration RECIF TECHNOLOGIES participó en un HORIZON EUROPE HORIZON-KDT-JU-2023-1-IA The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its con...
2024-05-17 - 2027-04-30 | Financiado
14AMI: 14 Angstroms Module Integration RECIF TECHNOLOGIES participó en un HORIZON EUROPE HORIZON-KDT-JU-2022-1-IA The 14AMI project is about creating technological solutions for the 14 Angstrom CMOS technology node, including a fully integrated functiona...
2023-05-10 - 2026-04-30 | Financiado
14ACMOS: 14 Anstrom CMOS IC technology RECIF TECHNOLOGIES participó en un HORIZON EUROPE HORIZON-KDT-JU-2021-1-IA 14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manuf...
2022-11-27 - 2025-11-30 | Financiado
ID2PPAC: Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requi... RECIF TECHNOLOGIES participó en un H2020 H2020-ECSEL-2020-1-IA-two-stage In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated...
2021-05-12 - 2024-12-31 | Financiado
IT2: IC Technology for the 2nm Node RECIF TECHNOLOGIES participó en un H2020 H2020-ECSEL-2019-1-IA-two-stage The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic...
2020-05-19 - 2023-09-30 | Financiado
PIN3S: Pilot Integration of 3nm Semiconducter technology RECIF TECHNOLOGIES participó en un H2020 H2020-ECSEL-2018-1-IA-two-stage The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration,...
2019-05-13 - 2023-04-30 | Financiado
TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm RECIF TECHNOLOGIES participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado
TAKEMI5: Technology Advances and Key Enablers for Module Integration for 5 nm RECIF TECHNOLOGIES participó en un H2020 H2020-ECSEL-2016-2-IA-two-stage In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to...
2017-05-15 - 2019-11-30 | Financiado
SeNaTe: Seven Nanometer Technology RECIF TECHNOLOGIES participó en un H2020 ECSEL-2014-2 The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm d...
2015-08-27 - 2018-03-31 | Financiado
E450EDL: European 450mm Equipment Demo Line RECIF TECHNOLOGIES participó en un FP7 The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm waf...
Financiado
EEMI 450: European 450mm Equipment Materials Initiative Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, m...
Financiado
ENABLE450: Coordination Action to enable an effective European 450 mm Equipment Materials Network 5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm...
Financiado
EEM450PR: European E M 450mm Pilotline Readiness RECIF TECHNOLOGIES participó en un FP7 Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer...
Financiado
E450LMDAP: European 450mm Lithography and Metrology Development for Advanced Patterning RECIF TECHNOLOGIES participó en un FP7 The overall goal of the E450LMDAP project is to develop 450 mm lithography and metrology modules and tools and to initiate distributed pilot...
Financiado
Bridge450: Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs Foundri... Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor pr...
Financiado
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