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EEM450PR

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Cerrado

European E M 450mm Pilotline Readiness

Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring abou... ver más

01/03/2015

ASML NETHERLANDS B...

84M€

Presupuesto del proyecto: 84M€

Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Fecha límite participación Sin fecha límite de participación.

Ver 22 Participantes

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2015-03-01 No tenemos la información de la convocatoria

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Información adicional privada

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22 Participantes

ASML NETHERLANDS B.V.

0.00€ | Lider

Xycarb

N.D. | Participante

HQ-D

N.D. | Participante

OINT

N.D. | Participante

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Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Presupuesto del proyecto 84M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equipment, and later on sub 10nm process development. The consortium comprises 34 members (from 10 different European countries); 11 are SMEs and 4 are research institutes. The main objective of the work on lithography is the proof of concept at test bench level of 450 mm critical wafer stage technology to get prepared for 450 mm early lithography prototype realization in a subsequent phase. The work on materials is the follow-up activity of the EEMI450 project to reach the next level of 450mm wafer quality. To be able to produce these wafers with the required capabilities new sophisticated equipment for the Chemical Mechanical Polishing process step as well as very advanced equipment for final cleaning procedures will be developed and will be integrated in a 450mm wafer line. Next to technology development also a 450mm equipment development pilot line facility will be prepared by developing state-of-the-art facilities readiness, including stringent energy and contamination considerations taking recent ISMI Guidelines, Semi Standards and ITRS requirements and activities into account. Furthermore, work will be done on the development of pilotline-ready equipment and modules, and further optimization of prototypes, concerning front-end (wafer based) semiconductor processing. The companies that were involved in the ENIAC EEMI450 project will use the results obtained therein for further development of their respective equipment. Finally, metrology equipment performance will be enhanced to improve the current 300mm cost of ownership for 12nm technology control on 450mm wafers.

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