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E450EDL

Financiado

Cerrado

European 450mm Equipment Demo Line

The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with su... ver más

30/09/2016

ASML NETHERLANDS B...

206M€

Presupuesto del proyecto: 206M€

Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Fecha límite participación Sin fecha límite de participación.

Ver 26 Participantes

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2016-09-30 No tenemos la información de la convocatoria

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Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

26 Participantes

ASML NETHERLANDS B.V.

0.00€ | Lider

TU Delft

N.D. | Participante

Xycarb

N.D. | Participante

IBS

N.D. | Participante

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Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Presupuesto del proyecto 206M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first critical process module development by combining imec infrastructure with tools remaining at the site of the manufacturers (distributed pilot line). Multi-site processing will allow partners to participate in the world first 450mm integration studies and will be enabled by the controlled exchange of 450mm wafers between different sites. The consortium comprises 43 members (from 11 different European countries) with many SMEs and research institutes. The project is organized in five technical work packages and a work package on management and coordination. In the work package on integration and wafer processing first critical modules will be developed and will demonstrate the feasibility of processing on 450mm wafers. The main objective in the work package on lithography is to develop a wafer stage test-rig, which can be implemented into the pilot line system. In the work package on front end equipment several tools will be developed such as a plasma ion implant module, a plasma dry etch module, a RTP system and a single wafer cleaning system. Furthermore, in the dedicated work package on metrology 450mm metrology tool types will be developed for amongst others dielectric film thickness and composition measurements, defect inspection, defect review and analysis, optical critical dimensions (CD), overlay (mask and wafer) and 3D metrology. Finally, from the work package on wafer handling and automation a set of equipment will be provided to support the demo line operations, and facilitate the R&D dedicated to process and metrology modules.

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