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PIN3S

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Cerrado

Pilot Integration of 3nm Semiconducter technology

The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable... ver más

30/04/2023

ASML NETHERLANDS B...

119M€

Presupuesto del proyecto: 119M€

Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Fecha límite participación Sin fecha límite de participación.

Ver 26 Participantes

Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2023-04-30

ECSEL-2018-1-IA: ECSEL-2018-1-IA

I+D

Cerrada hace 6 años

0% 22% 100%

Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

26 Participantes

ASML NETHERLANDS B.V.

4.45M€ | Lider

PRODRIVE TECHNOLOGIES INNOVA...

N.D. | Participante

TAT

N.D. | Participante

CARL ZEISS MICROSCOPY GMBH

N.D. | Participante

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Duración del proyecto: 47 meses Fecha Inicio: 2019-05-13
Fecha Fin: 2023-04-30

Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Presupuesto del proyecto 119M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation. Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge network based on Universities of Germany, Heidelberg University Hospital, and the Netherland, TU Delft and the University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer. The project addresses Section 15 Electronics Components & Systems Process Technology, Equipment, Materials and Manufacturing, Major Challenge 4 Maintaining world leadership in Semiconductor Equipment, Materials and Manufacturing solutions and Major Challenge 1 Developing advanced logic and memory technology for nanoscale integration and application-driven performance of the ECSEL JU Annual Work Plan 2018. As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment & Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying new equipment and materials approximately two years ahead of introduction of volume production of advanced semiconductor manufacturers. With the results of the Pin3S project the consortium builds on realizing IC manufacturers to migrate to the 3nm Technology node which enables a class of new products which have more functionality, more performance and are more power efficient. As such it will form the bases for innovations yet to come enabling solutions that address the societal challenges in communication, mobility, health care, security, energy and safety & security.

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