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ID2PPAC

financed

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Integration of processes and moDules for the 2 nm node meeting Power Performance...

Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated with the objective to demonstrate that Performance Power Area and Cost (PPAC) requirement... see more

31/12/2024

ASML NETHERLANDS B...

107M€

Project Budget: 107M€

Project leader

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

PARTICIPATION DEPralty Sin fecha límite de participación.

Ver 27 Participantes

Financing granted El organismo H2020 notifico la concesión del proyecto The day 2024-12-31

ECSEL-2020-1-IA: ECSEL-IA

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characteristics of the participant

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Private Information

No hay información privada compartida para este proyecto. Habla con el coordinador.

27 Participantes

ASML NETHERLANDS B.V.

2.61M€ | Leader

ATM BROADCAST S.L.

188.06K€ | participant

CAMECA

140.00K€ | participant

AMTC

279.75K€ | participant

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Project duration: 43 months Date Start: 2021-05-12
End date: 2024-12-31

Project leader

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Project Budget 107M€

participation deadline Sin fecha límite de participación.

Project description In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated with the objective to demonstrate that Performance Power Area and Cost (PPAC) requirements for this generation of leading edge logic technology can be achieved. To continue the Moore’s law trajectory to the 2nm node, while meeting PPAC requirements, the combination of further advancements in EUV lithography & masks, 3D device structures, materials and metrology is required. The strength of the project pivots on the focused engagement of leading expert partners in these key interlocking areas and a shared pilot line. The ID2PPAC project, is expected to enable IC-fabs to do EUV-based, single-print, High Volume Manufacturing for the 2nm node by 2025. This technology evolution is driven by the growing demand for compute power which increases more than exponentially with time and has made the world migrate from 1 billion interconnected devices in the PC era to 10 billion in the Mobile + cloud era to the future Intelligence era in which there will be over 100 billion intelligent connected devices. To enable this growth, the semiconductor industry is continuously pursuing technology innovations to realize this progress as has been predicted by Moore’s Law and will continue to do so. The project will also help to expand Europe's technological capacity to act in this field, which is crucial for digitization, (edge) AI and for solving national, European and global societal challenges and will strengthen the consortium of leading European companies and institutes active in this sector.

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