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TAPES3

Financiado

Cerrado

Technology Advances for Pilotline of Enhanced Semiconductors for 3nm

"In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to discover, develop and demonstrate lithographic, metrology, EUV mask technology, devices and pr... ver más

31/01/2022

ASML NETHERLANDS B...

121M€

Presupuesto del proyecto: 121M€

Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Fecha límite participación Sin fecha límite de participación.

Ver 38 Participantes

Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2022-01-31

ECSEL-2017-1: IA

I+D

Cerrada hace 7 años

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Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

38 Participantes

ASML NETHERLANDS B.V.

7.58M€ | Lider

SIEMENS ELECTRONIC DESIGN AU...

138.90K€ | Participante

DEMCON BUNOVA B.V.

N.D. | Participante

SIEMENS INDUSTRY SOFTWARE A...

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Duración del proyecto: 44 meses Fecha Inicio: 2018-05-17
Fecha Fin: 2022-01-31

Líder del proyecto

ASML NETHERLANDS B.V. No se ha especificado una descripción o un objeto social para esta compañía.

Presupuesto del proyecto 121M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to discover, develop and demonstrate lithographic, metrology, EUV mask technology, devices and process modules enabling 3nm node technology. This is planned with available EUV/NA 0.33 scanners, and with system design and integration of a new hyper NA EUV lithography tool to enable more single exposure patterning at 3nm to create complex integrated circuits. Process steps for 3D devices as alternative to the conventional FINFet will be explored for application in the 3nm node. The impact of the application of these so called 3D devices on circuit topology and logic design will be explored. During the development, specific challenges in metrology for the characterization of 3D devices will be assessed and metrology tools will be newly developed. The result will be demonstrated in the imec pilot line. The TAPES3 project relates to the ECSEL work program topic Equipment, Material and Manufacturing. It addresses and targets, as set out in MASP, the grand Challange of ""More Moore Equipment and Materials for sub 10nm technologies"" by exploring the requirements and solutions for the 3nm node. The project touches the core of the continuation of Moore’s law. Moreover, the cost aware development process will support the involved companies, and will place them in a preferred position over their worldwide competition. Through their worldwide affiliations, the impact of the TAPES3 project will be felt outside Europe in America and Asia Pacific semiconductor centers and is expected to benefit the European economy a lot by supporting its semiconductor equipment and metrology sectors with innovations, exports and employment."

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