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10ACe: 10 Angstrom CMOS exploration KLA-TENCOR CORPORATION (ISRAEL) participó en un HORIZON EUROPE: HORIZON-KDT-JU-2023-1-IA The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its con...
2024-05-17 - 2027-04-30 | Financiado

14AMI: 14 Angstroms Module Integration KLA-TENCOR CORPORATION (ISRAEL) participó en un HORIZON EUROPE: HORIZON-KDT-JU-2022-1-IA The 14AMI project is about creating technological solutions for the 14 Angstrom CMOS technology node, including a fully integrated functiona...
2023-05-10 - 2026-04-30 | Financiado

14ACMOS: 14 Anstrom CMOS IC technology KLA-TENCOR CORPORATION (ISRAEL) participó en un HORIZON EUROPE: HORIZON-KDT-JU-2021-1-IA 14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manuf...
2022-11-27 - 2025-11-30 | Financiado

ID2PPAC: Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requi... KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: H2020-ECSEL-2020-1-IA-two-stage In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated...
2021-05-12 - 2024-12-31 | Financiado

IT2: IC Technology for the 2nm Node KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic...
2020-05-19 - 2023-09-30 | Financiado

MADEin4: Metrology Advances for Digitized ECS industry 4.0 KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado

PIN3S: Pilot Integration of 3nm Semiconducter technology KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration,...
2019-05-13 - 2023-04-30 | Financiado

TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado

TAKEMI5: Technology Advances and Key Enablers for Module Integration for 5 nm KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to...
2017-05-15 - 2019-11-30 | Financiado

TAKE5: Technology Advances and Key Enablers for 5 nm KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: H2020-ECSEL-2015-2-IA-two-stage-Master The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm de...
2016-05-04 - 2019-03-31 | Financiado

SeNaTe: Seven Nanometer Technology KLA-TENCOR CORPORATION (ISRAEL) participó en un H2020: ECSEL-2014-2 The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm d...
2015-08-27 - 2018-03-31 | Financiado

E450EDL: European 450mm Equipment Demo Line KLA-TENCOR CORPORATION (ISRAEL) participó en un FP7: The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm waf...
Financiado

SEAL: Semiconductor Equipment Assessment Leveraging Innovation KLA-TENCOR CORPORATION (ISRAEL) participó en un FP7: SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado

EEM450PR: European E M 450mm Pilotline Readiness KLA-TENCOR CORPORATION (ISRAEL) participó en un FP7: Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer...
Financiado

E450LMDAP: European 450mm Lithography and Metrology Development for Advanced Patterning KLA-TENCOR CORPORATION (ISRAEL) participó en un FP7: The overall goal of the E450LMDAP project is to develop 450 mm lithography and metrology modules and tools and to initiate distributed pilot...
Financiado

MAGIC: MAsk less lithoGraphy for IC manufacturing MAGIC KLA-TENCOR CORPORATION (ISRAEL) participó en un FP7: In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now the driving solution to deal with all indus...
Financiado

MEMI: Micromirror enhanced micro imaging KLA-TENCOR CORPORATION (ISRAEL) participó en un FP7: An essential part of high-end optical microscopes is the ability to control various apertures and stops in both the illumination and imaging...
Financiado