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SOIL: Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedde...
2024-07-16 - 2027-05-31 | Financiado

FastLane: Boosting the European Value Chain for Sustainable Power Electronics ION BEAM SERVICES participó en un HORIZON EUROPE: HORIZON-KDT-JU-2023-1-IA FastLane targets a full, highly competitive and sustainable European value chain for Silicon Carbide (SiC) based power electronics. The goal...
2024-05-22 - 2027-04-30 | Financiado

10ACe: 10 Angstrom CMOS exploration ION BEAM SERVICES participó en un HORIZON EUROPE: HORIZON-KDT-JU-2023-1-IA The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its con...
2024-05-17 - 2027-04-30 | Financiado

14ACMOS: 14 Anstrom CMOS IC technology ION BEAM SERVICES participó en un HORIZON EUROPE: HORIZON-KDT-JU-2021-1-IA 14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manuf...
2022-11-27 - 2025-11-30 | Financiado

YESvGaN: Vertical GaN on Silicon Wide Band Gap Power at Silicon Cost ION BEAM SERVICES participó en un H2020: H2020-ECSEL-2020-2-RIA-two-stage YESvGaN targets a new low-cost wide band gap (WBG) power transistor technology for enabling high-efficiency power electronic systems in the...
2021-05-12 - 2024-10-31 | Financiado

IT2: IC Technology for the 2nm Node ION BEAM SERVICES participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic...
2020-05-19 - 2023-09-30 | Financiado

HighLite: High performance low cost modules with excellent environmental profiles for a competitive EU PV manu... ION BEAM SERVICES participó en un H2020: H2020-LC-SC3-2018-2019-2020 The HighLite project aims to substantially improve the competitiveness of the EU PV manufacturing industry by developing knowledge-based man...
2019-07-12 - 2023-03-31 | Financiado

PIN3S: Pilot Integration of 3nm Semiconducter technology ION BEAM SERVICES participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration,...
2019-05-13 - 2023-04-30 | Financiado

OCEAN12: Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node ION BEAM SERVICES participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage OCEAN12 targets the key societal challenge of smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors...
2018-05-23 - 2022-09-30 | Financiado

TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm ION BEAM SERVICES participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado

TAKEMI5: Technology Advances and Key Enablers for Module Integration for 5 nm ION BEAM SERVICES participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to...
2017-05-15 - 2019-11-30 | Financiado

CHALLENGE: 3C SiC Hetero epitaxiALLy grown on silicon compliancE substrates and 3C SiC substrates for sustaiNab... ION BEAM SERVICES participó en un H2020: H2020-NMBP-2016-2017 Silicon carbide presents a high breakdown field (2-4 MV/cm) and a high energy band gap (2.3–3.2 eV), largely higher than for silicon. Within...
2016-11-09 - 2021-06-30 | Financiado

SemI40: Power Semiconductor and Electronics Manufacturing 4.0 ION BEAM SERVICES participó en un H2020: H2020-ECSEL-2015-2-IA-two-stage-Master Addressing European Policies for 2020 and beyond the Power Semiconductor and Electronics Manufacturing 4.0 (SemI40) project responds to the...
2016-05-04 - 2019-04-30 | Financiado

GreenDiamond: Green Electronics with Diamond Power Devices ION BEAM SERVICES participó en un H2020: H2020-LCE-2014-2015 The key to the efficient transmission and conversion of low-carbon electrical energy is the improvement of power electronic devices. Diamond...
2015-04-16 - 2020-10-31 | Financiado

PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe ION BEAM SERVICES participó en un FP6: Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
2012-12-03 - 2015-12-31 | Financiado

PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes Built in Europe ION BEAM SERVICES participó en un FP7: Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
Financiado

ATEMOX: Advanced TEchnology MOdelling for eXtra functionality devices ION BEAM SERVICES participó en un FP7: Within previous European projects with major contributions by the current proposers, process simulation has been brought to a state which al...
Financiado

E450EDL: European 450mm Equipment Demo Line ION BEAM SERVICES participó en un FP7: The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm waf...
Financiado

EEMI 450: European 450mm Equipment Materials Initiative Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, m...
Financiado

SEAL: Semiconductor Equipment Assessment Leveraging Innovation ION BEAM SERVICES participó en un FP7: SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado

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