Innovating Works

IBS

Desconocido
SOIL: Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedde...
2024-07-16 - 2027-05-31 | Financiado
FastLane: Boosting the European Value Chain for Sustainable Power Electronics ION BEAM SERVICES participó en un HORIZON EUROPE HORIZON-KDT-JU-2023-1-IA FastLane targets a full, highly competitive and sustainable European value chain for Silicon Carbide (SiC) based power electronics. The goal...
2024-05-22 - 2027-04-30 | Financiado
10ACe: 10 Angstrom CMOS exploration ION BEAM SERVICES participó en un HORIZON EUROPE HORIZON-KDT-JU-2023-1-IA The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its con...
2024-05-17 - 2027-04-30 | Financiado
14ACMOS: 14 Anstrom CMOS IC technology ION BEAM SERVICES participó en un HORIZON EUROPE HORIZON-KDT-JU-2021-1-IA 14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manuf...
2022-11-27 - 2025-11-30 | Financiado
YESvGaN: Vertical GaN on Silicon Wide Band Gap Power at Silicon Cost ION BEAM SERVICES participó en un H2020 H2020-ECSEL-2020-2-RIA-two-stage YESvGaN targets a new low-cost wide band gap (WBG) power transistor technology for enabling high-efficiency power electronic systems in the...
2021-05-12 - 2024-10-31 | Financiado
IT2: IC Technology for the 2nm Node ION BEAM SERVICES participó en un H2020 H2020-ECSEL-2019-1-IA-two-stage The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic...
2020-05-19 - 2023-09-30 | Financiado
HighLite: High performance low cost modules with excellent environmental profiles for a competitive EU PV manu... ION BEAM SERVICES participó en un H2020 H2020-LC-SC3-2018-2019-2020 The HighLite project aims to substantially improve the competitiveness of the EU PV manufacturing industry by developing knowledge-based man...
2019-07-12 - 2023-03-31 | Financiado
PIN3S: Pilot Integration of 3nm Semiconducter technology ION BEAM SERVICES participó en un H2020 H2020-ECSEL-2018-1-IA-two-stage The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration,...
2019-05-13 - 2023-04-30 | Financiado
OCEAN12: Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node ION BEAM SERVICES participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage OCEAN12 targets the key societal challenge of smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors...
2018-05-23 - 2022-09-30 | Financiado
TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm ION BEAM SERVICES participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado
TAKEMI5: Technology Advances and Key Enablers for Module Integration for 5 nm ION BEAM SERVICES participó en un H2020 H2020-ECSEL-2016-2-IA-two-stage In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to...
2017-05-15 - 2019-11-30 | Financiado
CHALLENGE: 3C SiC Hetero epitaxiALLy grown on silicon compliancE substrates and 3C SiC substrates for sustaiNab... ION BEAM SERVICES participó en un H2020 H2020-NMBP-2016-2017 Silicon carbide presents a high breakdown field (2-4 MV/cm) and a high energy band gap (2.3–3.2 eV), largely higher than for silicon. Within...
2016-11-09 - 2021-06-30 | Financiado
SemI40: Power Semiconductor and Electronics Manufacturing 4.0 ION BEAM SERVICES participó en un H2020 H2020-ECSEL-2015-2-IA-two-stage-Master Addressing European Policies for 2020 and beyond the Power Semiconductor and Electronics Manufacturing 4.0 (SemI40) project responds to the...
2016-05-04 - 2019-04-30 | Financiado
GreenDiamond: Green Electronics with Diamond Power Devices ION BEAM SERVICES participó en un H2020 H2020-LCE-2014-2015 The key to the efficient transmission and conversion of low-carbon electrical energy is the improvement of power electronic devices. Diamond...
2015-04-16 - 2020-10-31 | Financiado
PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe ION BEAM SERVICES participó en un FP6 Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
2012-12-03 - 2015-12-31 | Financiado
PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes Built in Europe ION BEAM SERVICES participó en un FP7 Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
Financiado
ATEMOX: Advanced TEchnology MOdelling for eXtra functionality devices ION BEAM SERVICES participó en un FP7 Within previous European projects with major contributions by the current proposers, process simulation has been brought to a state which al...
Financiado
E450EDL: European 450mm Equipment Demo Line ION BEAM SERVICES participó en un FP7 The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm waf...
Financiado
EEMI 450: European 450mm Equipment Materials Initiative Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, m...
Financiado
SEAL: Semiconductor Equipment Assessment Leveraging Innovation ION BEAM SERVICES participó en un FP7 SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado
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