Innovating Works

ST

Desconocido
GaN4AP: GaN for Advanced Power Applications STMICROELECTRONICS TOURS SAS participó en un H2020: H2020-ECSEL-2020-1-IA-two-stage GaN4AP project has the ambitious target of making the GaN-based electronics to become the main power active device present in all power conv...
2021-05-12 - 2025-08-31 | Financiado
YESvGaN: Vertical GaN on Silicon Wide Band Gap Power at Silicon Cost STMICROELECTRONICS TOURS SAS participó en un H2020: H2020-ECSEL-2020-2-RIA-two-stage YESvGaN targets a new low-cost wide band gap (WBG) power transistor technology for enabling high-efficiency power electronic systems in the...
2021-05-12 - 2024-10-31 | Financiado
MADEin4: Metrology Advances for Digitized ECS industry 4.0 STMICROELECTRONICS TOURS SAS participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado
OPERA: Space Qualification and Validation of High Performance European Rad Hard FPGA STMICROELECTRONICS TOURS SAS participó en un H2020: H2020-SPACE-2018-2020 The OPERA project sets clear and measurable main objectives to reach a TRL 7 as follows: 1. Validation and tradeoff by end users of NanoXpl...
2018-10-22 - 2024-03-31 | Financiado
EnSO: Energy for Smart Objects STMICROELECTRONICS TOURS SAS participó en un H2020: H2020-ECSEL-2015-2-IA-two-stage-Master The goal of EnSO is to develop and consolidate a unique European ecosystem in the field of autonomous micro energy sources (AMES) supporting...
2016-05-04 - 2020-04-30 | Financiado
VEGAS: Validation of European high capacity rad hard FPGA and software tools STMICROELECTRONICS TOURS SAS participó en un H2020: H2020-COMPET-2015 VEGAS proposes to address the key challenge of European non-dependence and competitivness regarding rad-hard FPGA for space applications. VE...
2015-11-23 - 2020-08-31 | Financiado
AGATE: DEVELOPMENT OF ADVANCED GAN TECHNOLOGIES STMICROELECTRONICS TOURS SAS participó en un FP6: According to the High-Level Experts Group (HLG) micro and nanoelectronics are essential for all goods and services which need intelligent co...
2013-04-01 - 2016-03-31 | Financiado
ESIP: Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test STMICROELECTRONICS TOURS SAS participó en un FP6: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
2010-05-01 - 2013-04-01 | Financiado
ESIP: Efficient Silicon Multi Chip System in Package Integration Reliability Failure Analysis and Test STMICROELECTRONICS TOURS SAS participó en un FP7: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
Financiado
Interflex: Interconnection technologies for flexible systems STMICROELECTRONICS TOURS SAS participó en un FP7: InterFlex targets the development and standardisation of interconnects within flexible foil systems: On-foil connections of different compon...
Financiado
E-STARS: Efficient Smart sysTems with enhAnced eneRgy Storage STMICROELECTRONICS TOURS SAS participó en un FP7: E-STARS project aims at developing enhanced sensing and communication capability on an autonomous smart micro system powered by a new 3D hig...
Financiado
AGATE: DEVELOPMENT OF ADVANCED GAN TECHNOLOGIES STMICROELECTRONICS TOURS SAS participó en un FP7: According to the High-Level Experts Group (HLG) micro and nanoelectronics are essential for all goods and services which need intelligent co...
Financiado
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