Efficient Silicon Multi Chip System in Package Integration Reliability Failur...
Efficient Silicon Multi Chip System in Package Integration Reliability Failure Analysis and Test
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality op...
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Descripción del proyecto
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, through-silicon via technologies or package-stacking approaches are growing in importance. Market studies show that SiP devices will have an average growth of 10 to 20% per year over the next five years.