Innovating Works

SILTRONIC AG

Desconocido
MATQu: Materials for Quantum Computing SILTRONIC AG participó en un H2020 H2020-ECSEL-2020-2-RIA-two-stage Over the past 60+ years CMOS-based digital computing has giving rise to ever-greater computational performance, „big data-based business mod...
2021-05-12 - 2024-05-31 | Financiado
YESvGaN: Vertical GaN on Silicon Wide Band Gap Power at Silicon Cost SILTRONIC AG participó en un H2020 H2020-ECSEL-2020-2-RIA-two-stage YESvGaN targets a new low-cost wide band gap (WBG) power transistor technology for enabling high-efficiency power electronic systems in the...
2021-05-12 - 2024-10-31 | Financiado
BEYOND5: Building the fully European supplY chain on RFSOI enabling New RF Domains for Sensing Communicatio... SILTRONIC AG participó en un H2020 H2020-ECSEL-2019-1-IA-two-stage The overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for s...
2020-05-28 - 2024-12-31 | Financiado
Power2Power: The next generation silicon based power solutions in mobility industry and grid for sustainable dec... SILTRONIC AG participó en un H2020 H2020-ECSEL-2018-1-IA-two-stage The objectives in Power2Power aim to foster a holistic, digitized pilot line approach by accelerating the transition of ideas to innovations...
2019-05-24 - 2022-09-30 | Financiado
UltimateGaN: Research for GaN technologies devices packages and applications to address the challenges of the f... SILTRONIC AG participó en un H2020 H2020-LC-SC3-2018-2019-2020 The main objective of UltimateGaN is to safeguard Europe’s leading position in terms of power semiconductors and high performance RF applica...
2019-05-10 - 2022-10-31 | Financiado
TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm SILTRONIC AG participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado
R3-PowerUP: 300mm Pilot Line for Smart Power and Power Discretes SILTRONIC AG participó en un H2020 H2020-ECSEL-2016-2-IA-two-stage R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the Euro...
2017-05-15 - 2023-04-30 | Financiado
Productive4.0: Electronics and ICT as enabler for digital industry and optimized supply chain management covering t... SILTRONIC AG participó en un H2020 H2020-ECSEL-2016-2-IA-two-stage PRODUCTIVE4.0 - AMBITIOUS PROJECT WITH A UNIQUE MAIN OBJECTIVE The main objective of Productive4.0 is to achieve improvement of digitising t...
2017-05-15 - 2020-10-31 | Financiado
REFERENCE: Rf Engineered substrates to FostER fEm performaNCE SILTRONIC AG participó en un H2020 H2020-ECSEL-2015-1-RIA-two-stage-Master The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disrupt...
2016-07-05 - 2019-11-30 | Financiado
PowerBase: Enhanced substrates and GaN pilot lines enabling compact power applications SILTRONIC AG participó en un H2020 ECSEL-2014-2 The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of...
2015-07-07 - 2018-06-30 | Financiado
WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... SILTRONIC AG participó en un H2020 ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-06-16 - 2017-12-31 | Financiado
WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... SILTRONIC AG participó en un FP6 ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-05-01 - 2017-12-31 | Financiado
PowerBase: Enhanced substrates and GaN pilot lines enabling compact power applications SILTRONIC AG participó en un FP6 ECSEL-2014-2 The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of...
2015-05-01 - 2018-06-30 | Financiado
EPT300: Enable power technologies on 300mm wafer diameter EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore m...
Financiado
EEMI 450: European 450mm Equipment Materials Initiative Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, m...
Financiado
SEAL: Semiconductor Equipment Assessment Leveraging Innovation SILTRONIC AG participó en un FP7 SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado
EEM450PR: European E M 450mm Pilotline Readiness SILTRONIC AG participó en un FP7 Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer...
Financiado
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