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MATQu: Materials for Quantum Computing SILTRONIC AG participó en un H2020: H2020-ECSEL-2020-2-RIA-two-stage Over the past 60+ years CMOS-based digital computing has giving rise to ever-greater computational performance, „big data-based business mod...
2021-05-12 - 2024-05-31 | Financiado

YESvGaN: Vertical GaN on Silicon Wide Band Gap Power at Silicon Cost SILTRONIC AG participó en un H2020: H2020-ECSEL-2020-2-RIA-two-stage YESvGaN targets a new low-cost wide band gap (WBG) power transistor technology for enabling high-efficiency power electronic systems in the...
2021-05-12 - 2024-10-31 | Financiado

BEYOND5: Building the fully European supplY chain on RFSOI enabling New RF Domains for Sensing Communicatio... SILTRONIC AG participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage The overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for s...
2020-05-28 - 2024-12-31 | Financiado

Power2Power: The next generation silicon based power solutions in mobility industry and grid for sustainable dec... SILTRONIC AG participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The objectives in Power2Power aim to foster a holistic, digitized pilot line approach by accelerating the transition of ideas to innovations...
2019-05-24 - 2022-09-30 | Financiado

UltimateGaN: Research for GaN technologies devices packages and applications to address the challenges of the f... SILTRONIC AG participó en un H2020: H2020-LC-SC3-2018-2019-2020 The main objective of UltimateGaN is to safeguard Europe’s leading position in terms of power semiconductors and high performance RF applica...
2019-05-10 - 2022-10-31 | Financiado

TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm SILTRONIC AG participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado

R3-PowerUP: 300mm Pilot Line for Smart Power and Power Discretes SILTRONIC AG participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the Euro...
2017-05-15 - 2023-04-30 | Financiado

Productive4.0: Electronics and ICT as enabler for digital industry and optimized supply chain management covering t... SILTRONIC AG participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage PRODUCTIVE4.0 - AMBITIOUS PROJECT WITH A UNIQUE MAIN OBJECTIVE The main objective of Productive4.0 is to achieve improvement of digitising t...
2017-05-15 - 2020-10-31 | Financiado

REFERENCE: Rf Engineered substrates to FostER fEm performaNCE SILTRONIC AG participó en un H2020: H2020-ECSEL-2015-1-RIA-two-stage-Master The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disrupt...
2016-07-05 - 2019-11-30 | Financiado

PowerBase: Enhanced substrates and GaN pilot lines enabling compact power applications SILTRONIC AG participó en un H2020: ECSEL-2014-2 The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of...
2015-07-07 - 2018-06-30 | Financiado

WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... SILTRONIC AG participó en un H2020: ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-06-16 - 2017-12-31 | Financiado

WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... SILTRONIC AG participó en un FP6: ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-05-01 - 2017-12-31 | Financiado

PowerBase: Enhanced substrates and GaN pilot lines enabling compact power applications SILTRONIC AG participó en un FP6: ECSEL-2014-2 The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of...
2015-05-01 - 2018-06-30 | Financiado

EPT300: Enable power technologies on 300mm wafer diameter EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore m...
Financiado

EEMI 450: European 450mm Equipment Materials Initiative Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, m...
Financiado

SEAL: Semiconductor Equipment Assessment Leveraging Innovation SILTRONIC AG participó en un FP7: SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado

EEM450PR: European E M 450mm Pilotline Readiness SILTRONIC AG participó en un FP7: Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer...
Financiado