Innovating Works

PVA-AS

Desconocido
ID2PPAC: Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requi... PVA TEPLA ANALYTICAL SYSTEMS GMBH participó en un H2020: H2020-ECSEL-2020-1-IA-two-stage In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated...
2021-05-12 - 2024-12-31 | Financiado
MADEin4: Metrology Advances for Digitized ECS industry 4.0 PVA TEPLA ANALYTICAL SYSTEMS GMBH participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado
METRO4-3D: Metrology for future 3D technologies PVA TEPLA ANALYTICAL SYSTEMS GMBH participó en un H2020: H2020-ICT-2015 Within the food chain of equipment delivery for the semiconductor industry, Europe has kept a very strong position in the metrology area wit...
2015-11-25 - 2019-01-31 | Financiado
ESIP: Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test PVA TEPLA ANALYTICAL SYSTEMS GMBH participó en un FP6: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
2010-05-01 - 2013-04-01 | Financiado
EEMI 450: European 450mm Equipment Materials Initiative Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, m...
Financiado
SEAL: Semiconductor Equipment Assessment Leveraging Innovation PVA TEPLA ANALYTICAL SYSTEMS GMBH participó en un FP7: SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado
ESIP: Efficient Silicon Multi Chip System in Package Integration Reliability Failure Analysis and Test PVA TEPLA ANALYTICAL SYSTEMS GMBH participó en un FP7: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
Financiado
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