LAM RESEARCH AG
Desconocido
10ACe: 10 Angstrom CMOS exploration
LAM RESEARCH AG
participó en un
HORIZON EUROPE:
HORIZON-KDT-JU-2023-1-IA
The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its con...
2024-05-17 - 2027-04-30 | Financiado
2024-05-17 - 2027-04-30 | Financiado
TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm
LAM RESEARCH AG
participó en un
H2020:
H2020-ECSEL-2017-1-IA-two-stage
"In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the
TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado
2018-05-17 - 2022-01-31 | Financiado
SeNaTe: Seven Nanometer Technology
LAM RESEARCH AG
participó en un
H2020:
ECSEL-2014-2
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm d...
2015-08-27 - 2018-03-31 | Financiado
2015-08-27 - 2018-03-31 | Financiado
WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie...
LAM RESEARCH AG
participó en un
H2020:
ECSEL-2014-2
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-06-16 - 2017-12-31 | Financiado
2015-06-16 - 2017-12-31 | Financiado
WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie...
LAM RESEARCH AG
participó en un
FP6:
ECSEL-2014-2
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-05-01 - 2017-12-31 | Financiado
2015-05-01 - 2017-12-31 | Financiado
EPT300: Enable power technologies on 300mm wafer diameter
EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore m...
Financiado
Financiado
CopPeR: Copper Interconnects for Advanced Performance and Reliability
LAM RESEARCH AG
participó en un
FP7:
The CopPeR project will provide a novel copper deposition process based on the useof non-aqueous solvents to overcome the limitations of cur...
Financiado
Financiado
E450EDL: European 450mm Equipment Demo Line
LAM RESEARCH AG
participó en un
FP7:
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm waf...
Financiado
Financiado
SEAL: Semiconductor Equipment Assessment Leveraging Innovation
LAM RESEARCH AG
participó en un
FP7:
SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado
Financiado
EEM450PR: European E M 450mm Pilotline Readiness
LAM RESEARCH AG
participó en un
FP7:
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer...
Financiado
Financiado
SEA4KET: Semiconductor Equipment Assessment for Key Enabling Technologies
LAM RESEARCH AG
participó en un
FP7:
SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D t...
Financiado
Financiado
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