Innovating Works

COVENTOR SARL

Desconocido
10ACe: 10 Angstrom CMOS exploration COVENTOR SARL participó en un HORIZON EUROPE HORIZON-KDT-JU-2023-1-IA The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its con...
2024-05-17 - 2027-04-30 | Financiado
14ACMOS: 14 Anstrom CMOS IC technology COVENTOR SARL participó en un HORIZON EUROPE HORIZON-KDT-JU-2021-1-IA 14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manuf...
2022-11-27 - 2025-11-30 | Financiado
ID2PPAC: Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requi... COVENTOR SARL participó en un H2020 H2020-ECSEL-2020-1-IA-two-stage In the ID2PPAC project the technology solutions for the 2nm node identified in the preceding project IT2 will be consolidated and integrated...
2021-05-12 - 2024-12-31 | Financiado
IT2: IC Technology for the 2nm Node COVENTOR SARL participó en un H2020 H2020-ECSEL-2019-1-IA-two-stage The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic...
2020-05-19 - 2023-09-30 | Financiado
PIN3S: Pilot Integration of 3nm Semiconducter technology COVENTOR SARL participó en un H2020 H2020-ECSEL-2018-1-IA-two-stage The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration,...
2019-05-13 - 2023-04-30 | Financiado
TAPES3: Technology Advances for Pilotline of Enhanced Semiconductors for 3nm COVENTOR SARL participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage "In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to disc...
2018-05-17 - 2022-01-31 | Financiado
SILENSE: Ultra Sound Interfaces and Low Energy iNtegrated SEnsors COVENTOR SARL participó en un H2020 H2020-ECSEL-2016-1-RIA-two-stage The SILENSE project will focus on using smart acoustic technologies and ultrasound in particular for Human Machine- and Machine to Machine I...
2017-05-19 - 2020-04-30 | Financiado
TAKEMI5: Technology Advances and Key Enablers for Module Integration for 5 nm COVENTOR SARL participó en un H2020 H2020-ECSEL-2016-2-IA-two-stage In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to...
2017-05-15 - 2019-11-30 | Financiado
TAKE5: Technology Advances and Key Enablers for 5 nm COVENTOR SARL participó en un H2020 H2020-ECSEL-2015-2-IA-two-stage-Master The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm de...
2016-05-04 - 2019-03-31 | Financiado
SeNaTe: Seven Nanometer Technology COVENTOR SARL participó en un H2020 ECSEL-2014-2 The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm d...
2015-08-27 - 2018-03-31 | Financiado
PARSIMO: Partitioning and Modeling of SiP COVENTOR SARL tramitó un FP6 Integration of heterogeneous systems in a package (SiP) allows smaller, smarter and more energy efficient products for many applications. Th...
2011-03-01 - 2014-06-01 | Financiado
PARSIMO: Partitioning and Modeling of SiP COVENTOR SARL tramitó un FP7 Integration of heterogeneous systems in a package (SiP) allows smaller, smarter and more energy efficient products for many applications. Th...
Financiado
SMAC: SMArt systems Co design COVENTOR SARL participó en un FP7 Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as "Mult...
Financiado
E450LMDAP: European 450mm Lithography and Metrology Development for Advanced Patterning COVENTOR SARL participó en un FP7 The overall goal of the E450LMDAP project is to develop 450 mm lithography and metrology modules and tools and to initiate distributed pilot...
Financiado
NANOTEC: Nanostructured materials and RF MEMS RFIC MMIC technologies for highly adaptive and reliable RF syst... COVENTOR SARL participó en un FP7 RF communication and remote sensing (radar/radiometric) systems are facing the demands ofincreasing complexity/number of frequency bands, in...
Financiado
PIEZOVOLUME: High volume piezoelectric thin film production process for microsystems COVENTOR SARL participó en un FP7 This proposal will address high volume production of MEMS (Micro-Electro Mechanical Systems) with a piezoelectric thin film as active elemen...
Financiado
CORONA: Customer Oriented Product Engineering of Micro and Nano Devices The competitiveness of EC companies in micro and nano technologies (MNT) very much relies on short time-to-market. That is true in particula...
Financiado
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