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Monolithically Integrated ReRAM and In-Chip Cooling for Emerging Neuromorphic Ap...

Monolithically Integrated ReRAM and In-Chip Cooling for Emerging Neuromorphic Applications Heat generation and removal thereof is one of the main challenges for the realization of many future high performance electronics. The heat wall is one of the biggest obstacles to processing large amount of data using the conventi... ver más

31/08/2024

BILKENTUNIVERSITY...

133K€

Presupuesto del proyecto: 133K€

Líder del proyecto

BILKENT UNIVERSITESI VAKIF No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Financiación concedida El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2024-08-31

HORIZON-WIDERA-2022-TALENTS-02-01: Fostering balanced brain circulatio... ExpectedOutcome:This action builds on the MSCA Postdoctoral Fellowships 2021 action (HORIZON-MSCA-PF...

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1 Participantes

BILKENTUNIVERSITY BILIM KENT...

132.64K€ | Lider

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Duración del proyecto: 23 meses Fecha Inicio: 2022-09-01
Fecha Fin: 2024-08-31

Líder del proyecto

BILKENT UNIVERSITESI VAKIF No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 133K€

Descripción del proyecto Heat generation and removal thereof is one of the main challenges for the realization of many future high performance electronics. The heat wall is one of the biggest obstacles to processing large amount of data using the conventional computing architectures. To address this formidable challenge, smart architectural approaches that consider co-design of electronics and thermal management, as well as emerging solutions beyond CMOS, are needed. A resistive switching memory cell ReRAM is a promising candidate for such a technology, which offers performance improvements in digital circuits without a need for aggressive device scaling when combined with transistors. Ultimately, the solution may come from monolithic integration of novel electronics and cooling within the same substrate. In-chip cooling has been recently demonstrated to be promising in GaN power electronics on silicon. However, the multi-step and complicated process flow adopted for fabricating the in-chip heat sink in the state-of-the-art could pose a big challenge for the wide adoption of this new, scientifically and technologically interesting concept. 3D laser lithography is a currently unrealized opportunity to fabricate in-chip microchannels for cooling with substantially simplified fabrication and without a need for cleanroom facilities. Complex 3D structures can be fabricated by this method through a two-step process that includes femtosecond laser irradiation followed by wet chemical etching. In view of the above mentioned, we target to develop memristive arrays integrated with laser-micro-machined in-chip cooling. This offers an immediate and rapid path to overcome the thermal challenges facing today’s computing architectures, and is of relevance to other technologies that suffer from heating during operation. We seek to exploit the highly efficient embedded cooling to pioneer agenda setting advances in addressing the well-known thermal limitations of future logic and memory technologies.

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