MIMIC
Financiado
Monolithically Integrated ReRAM and In-Chip Cooling for Emerging Neuromorphic Ap...
Heat generation and removal thereof is one of the main challenges for the realization of many future high performance electronics. The heat wall is one of the biggest obstacles to processing large amount of data using the conventi...
Heat generation and removal thereof is one of the main challenges for the realization of many future high performance electronics. The heat wall is one of the biggest obstacles to processing large amount of data using the conventional computing architectures. To address this formidable challenge, smart architectural approaches that consider co-design of electronics and thermal management, as well as emerging solutions beyond CMOS, are needed. A resistive switching memory cell ReRAM is a promising candidate for such a technology, which offers performance improvements in digital circuits without a need for aggressive device scaling when combined with transistors.
Ultimately, the solution may come from monolithic integration of novel electronics and cooling within the same substrate. In-chip cooling has been recently demonstrated to be promising in GaN power electronics on silicon. However, the multi-step and complicated process flow adopted for fabricating the in-chip heat sink in the state-of-the-art could pose a big challenge for the wide adoption of this new, scientifically and technologically interesting concept.
3D laser lithography is a currently unrealized opportunity to fabricate in-chip microchannels for cooling with substantially simplified fabrication and without a need for cleanroom facilities. Complex 3D structures can be fabricated by this method through a two-step process that includes femtosecond laser irradiation followed by wet chemical etching.
In view of the above mentioned, we target to develop memristive arrays integrated with laser-micro-machined in-chip cooling. This offers an immediate and rapid path to overcome the thermal challenges facing today’s computing architectures, and is of relevance to other technologies that suffer from heating during operation. We seek to exploit the highly efficient embedded cooling to pioneer agenda setting advances in addressing the well-known thermal limitations of future logic and memory technologies.
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Duración del proyecto: 23 meses
Fecha Inicio: 2022-09-01
Fecha Fin: 2024-08-31
Fecha Fin: 2024-08-31
Línea de financiación: concedida
El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2024-08-31
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
Presupuesto
El presupuesto total del proyecto asciende a
133K€
Líder del proyecto
BILKENT UNIVERSITESI VAKIF
No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico
TRL
4-5
Perfil tecnológico
TRL
4-5