X-FAB Dresden
Desconocido
StorAIge: Embedded storage elements on next MCU generation ready for AI on the edge
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ECSEL-2020-1-IA-two-stage
The main objective of the storAIge project is the development and industrialization of FDSOI 28nm and next generation embedded Phase Change...
2021-05-12 - 2024-10-31 | Financiado
2021-05-12 - 2024-10-31 | Financiado
YESvGaN: Vertical GaN on Silicon Wide Band Gap Power at Silicon Cost
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ECSEL-2020-2-RIA-two-stage
YESvGaN targets a new low-cost wide band gap (WBG) power transistor technology for enabling high-efficiency power electronic systems in the...
2021-05-12 - 2024-10-31 | Financiado
2021-05-12 - 2024-10-31 | Financiado
iRel40: Intelligent Reliability 4.0
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ECSEL-2019-1-IA-two-stage
Intelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failur...
2020-05-19 - 2023-10-31 | Financiado
2020-05-19 - 2023-10-31 | Financiado
BeFerroSynaptic: BEOL technology platform based on ferroelectric synaptic devices for advanced neuromorphic processor...
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ICT-2018-20
The increasing amount of data that has to be processed in today’s electronic devices requires a transition from the conventional compute cen...
2019-11-29 - 2023-10-31 | Financiado
2019-11-29 - 2023-10-31 | Financiado
Power2Power: The next generation silicon based power solutions in mobility industry and grid for sustainable dec...
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ECSEL-2018-1-IA-two-stage
The objectives in Power2Power aim to foster a holistic, digitized pilot line approach by accelerating the transition of ideas to innovations...
2019-05-24 - 2022-09-30 | Financiado
2019-05-24 - 2022-09-30 | Financiado
WAKeMeUP: Wafers for Automotive and other Key applications using Memories embedded in Ulsi Processors
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ECSEL-2017-1-IA-two-stage
The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufac...
2018-05-22 - 2021-08-31 | Financiado
2018-05-22 - 2021-08-31 | Financiado
5G_GaN2: Advanced RF Transceivers for 5G base stations based on GaN Technology.
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ECSEL-2017-2-RIA-two-stage
TA new generation of communications infrastructure is currently in development. The fifth generation (5G) communications technologies will p...
2018-05-17 - 2022-05-31 | Financiado
2018-05-17 - 2022-05-31 | Financiado
ADMONT: Advanced Distributed Pilot Line for More than Moore Technologies
XFAB Dresden GmbH Co. KG
tramitó un
H2020:
ECSEL-2014-2
The Advanced Distributed Pilot Line for More-than-Moore Technologies project (ADMONT) is focused on a powerful and versatile More-than-Moore...
2015-07-14 - 2019-04-30 | Financiado
2015-07-14 - 2019-04-30 | Financiado
LOMID: LOMID Large cost effective OLED microdisplays and their applications
XFAB Dresden GmbH Co. KG
participó en un
H2020:
H2020-ICT-2014
The LOMID project will define pathways to the manufacture of flexible OLED microdisplays with an exceptionally large area (16 mm x 20 mm, sc...
2014-12-08 - 2018-06-30 | Financiado
2014-12-08 - 2018-06-30 | Financiado
ADMONT: Advanced Distributed Pilot Line for More-than-Moore Technologies
XFAB Dresden GmbH Co. KG
tramitó un
FP6:
ECSEL-2014-2
The Advanced Distributed Pilot Line for More-than-Moore Technologies project (ADMONT) is focused on a powerful and versatile More-than-Moore...
2015-05-01 - 2019-04-30 | Financiado
2015-05-01 - 2019-04-30 | Financiado
* No se disponen de datos de la empresa actual.