Innovating Works

GLOBALFOUNDRIES Dresden Module One LLC...

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Showing 1 to 20 of 21 results
SOIL: Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedde...
2024-07-16 - 2027-05-31 | Financiado
SIPHO-G: Advanced GeSi components for next generation silicon photonics applications GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020 H2020-ICT-2018-20 By developing 100Gbaud Germanium-Silicon (GeSi) Quantum-Confined Stark-Effect (QCSE) modulators and highly sensitive 100Gbaud avalanche phot...
2020-12-15 - 2025-06-30 | Financiado
BEYOND5: Building the fully European supplY chain on RFSOI enabling New RF Domains for Sensing Communicatio... GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020 H2020-ECSEL-2019-1-IA-two-stage The overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for s...
2020-05-28 - 2024-12-31 | Financiado
MADEin4: Metrology Advances for Digitized ECS industry 4.0 GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020 H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado
OCEAN12: Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020 H2020-ECSEL-2017-1-IA-two-stage OCEAN12 targets the key societal challenge of smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors...
2018-05-23 - 2022-09-30 | Financiado
REFERENCE: Rf Engineered substrates to FostER fEm performaNCE GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020 H2020-ECSEL-2015-1-RIA-two-stage-Master The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disrupt...
2016-07-05 - 2019-11-30 | Financiado
PRIME: Ultra Low PoweR technologIes and MEmory architectures for IoT GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020 H2020-ECSEL-2015-1-RIA-two-stage-Master The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architec...
2016-05-04 - 2019-09-30 | Financiado
WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020 ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-06-16 - 2017-12-31 | Financiado
WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6 ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-05-01 - 2017-12-31 | Financiado
THINGS2D0: THINGS2DO GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6 The program THINGS2DO is focused on building the Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely...
2014-01-01 - 2018-01-01 | Financiado
INTEGRATE: Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6 European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and prod...
2013-01-01 - 2015-12-31 | Financiado
PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6 Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
2012-12-03 - 2015-12-31 | Financiado
INTEGRATE: Integrated Solutions for Agile Manufacturing in High mix Semiconductor Fabs GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and prod...
Financiado
THINGS2D0: THINGS2DO GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 The program THINGS2DO is focused on building the Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely...
Financiado
PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes Built in Europe GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
Financiado
SEAL: Semiconductor Equipment Assessment Leveraging Innovation GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado
E450LMDAP: European 450mm Lithography and Metrology Development for Advanced Patterning GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 The overall goal of the E450LMDAP project is to develop 450 mm lithography and metrology modules and tools and to initiate distributed pilot...
Financiado
SEA4KET: Semiconductor Equipment Assessment for Key Enabling Technologies GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D t...
Financiado
III-V-MOS: Technology CAD for III V Semiconductor based MOSFETs GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 According to ITRS, III-V compound semiconductor n-type MOSFETs will reach production in 2018 as part of a new scaling scenario for high p...
Financiado
STEEPER: Steep subthreshold slope switches nfor energy efficient electronics GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7 STEEPER addresses the development of Beyond CMOS energy-efficient steep subthreshold slope transistors based on quantum mechanical band-to-b...
Financiado
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