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SOIL: Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedde...
2024-07-16 - 2027-05-31 | Financiado

SIPHO-G: Advanced GeSi components for next generation silicon photonics applications GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020: H2020-ICT-2018-20 By developing 100Gbaud Germanium-Silicon (GeSi) Quantum-Confined Stark-Effect (QCSE) modulators and highly sensitive 100Gbaud avalanche phot...
2020-12-15 - 2025-06-30 | Financiado

BEYOND5: Building the fully European supplY chain on RFSOI enabling New RF Domains for Sensing Communicatio... GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage The overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for s...
2020-05-28 - 2024-12-31 | Financiado

MADEin4: Metrology Advances for Digitized ECS industry 4.0 GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado

OCEAN12: Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage OCEAN12 targets the key societal challenge of smart mobility. Based on the innovative FDSOI technology, OCEAN12 will develop new processors...
2018-05-23 - 2022-09-30 | Financiado

REFERENCE: Rf Engineered substrates to FostER fEm performaNCE GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020: H2020-ECSEL-2015-1-RIA-two-stage-Master The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disrupt...
2016-07-05 - 2019-11-30 | Financiado

PRIME: Ultra Low PoweR technologIes and MEmory architectures for IoT GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020: H2020-ECSEL-2015-1-RIA-two-stage-Master The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architec...
2016-05-04 - 2019-09-30 | Financiado

WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un H2020: ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-06-16 - 2017-12-31 | Financiado

WAYTOGO FAST: Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologie... GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6: ECSEL-2014-2 The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (F...
2015-05-01 - 2017-12-31 | Financiado

THINGS2D0: THINGS2DO GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6: The program THINGS2DO is focused on building the Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely...
2014-01-01 - 2018-01-01 | Financiado

INTEGRATE: Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6: European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and prod...
2013-01-01 - 2015-12-31 | Financiado

PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP6: Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
2012-12-03 - 2015-12-31 | Financiado

INTEGRATE: Integrated Solutions for Agile Manufacturing in High mix Semiconductor Fabs GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and prod...
Financiado

THINGS2D0: THINGS2DO GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: The program THINGS2DO is focused on building the Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely...
Financiado

PLACES2BE: Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes Built in Europe GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology p...
Financiado

SEAL: Semiconductor Equipment Assessment Leveraging Innovation GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: SEAL is a project for an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing eq...
Financiado

E450LMDAP: European 450mm Lithography and Metrology Development for Advanced Patterning GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: The overall goal of the E450LMDAP project is to develop 450 mm lithography and metrology modules and tools and to initiate distributed pilot...
Financiado

SEA4KET: Semiconductor Equipment Assessment for Key Enabling Technologies GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D t...
Financiado

III-V-MOS: Technology CAD for III V Semiconductor based MOSFETs GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: According to ITRS, III-V compound semiconductor n-type MOSFETs will reach production in 2018 as part of a new scaling scenario for high p...
Financiado

STEEPER: Steep subthreshold slope switches nfor energy efficient electronics GLOBALFOUNDRIES Dresden Module One LLC Co. KG participó en un FP7: STEEPER addresses the development of Beyond CMOS energy-efficient steep subthreshold slope transistors based on quantum mechanical band-to-b...
Financiado

GLOBALFOUNDRIES Dresden Module One LLC...