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Mostrando 1 al 20 de 21 resultados

PowerizeD: Digitalization of Power Electronic Applications within Key Technology Value Chains The overarching goal of PowerizeD is to develop breakthrough technologies of digitalized and intelligent power electronics, in order to enab...
2022-12-01 - 2025-12-31 | Financiado

Power2Power: The next generation silicon based power solutions in mobility industry and grid for sustainable dec... BOSCHMAN TECHNOLOGIES BV participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The objectives in Power2Power aim to foster a holistic, digitized pilot line approach by accelerating the transition of ideas to innovations...
2019-05-24 - 2022-09-30 | Financiado

APPLAUSE: Advanced packaging for photonics optics and electronics for low cost manufacturing in Europe BOSCHMAN TECHNOLOGIES BV participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufa...
2019-05-23 - 2022-10-31 | Financiado

INLINETEST: In line quality inspection system for smart production of micro and nanoelectronic components BOSCHMAN TECHNOLOGIES BV participó en un H2020: H2020-ICT-2016-2017 Future micro/nano-electronics components production will need to be smart and provide instantaneous information on all items for complete tr...
2017-09-21 - 2021-11-30 | Financiado

HIOS: Highly Integrated Optoelectronic Sensor BOSCHMAN TECHNOLOGIES BV participó en un H2020: H2020-FTIPilot-2015-1 HIOS (Highly Integrated Optoelectronic Sensor) aims to develop and to launch world’s first light sensor with fully integrated optical stack....
2016-07-24 - 2019-07-31 | Financiado

IoSense: Flexible FE BE Sensor Pilot Line for the Internet of Everything BOSCHMAN TECHNOLOGIES BV participó en un H2020: H2020-ECSEL-2015-2-IA-two-stage-Master The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and cre...
2016-05-04 - 2019-04-30 | Financiado

InForMed: An integrated pilot line for micro fabricated medical devices BOSCHMAN TECHNOLOGIES BV participó en un H2020: ECSEL-2014-2 The goal of the InForMed project is to establish an integrated pilot line for medical devices. The pilot line includes micro-fabrication, as...
2015-07-10 - 2018-09-30 | Financiado

InForMed: An integrated pilot line for micro-fabricated medical devices BOSCHMAN TECHNOLOGIES BV participó en un FP6: ECSEL-2014-2 The goal of the InForMed project is to establish an integrated pilot line for medical devices. The pilot line includes micro-fabrication, as...
2015-06-01 - 2018-09-30 | Financiado

ERG: ENERGY FOR A GREEN SOCIETY: FROM SUSTAINABLE HARVESTING TO SMART DISTRIBUTION. EQUIPMENTS, MATERIAL... BOSCHMAN TECHNOLOGIES BV participó en un FP6: The ERG project focus on the solar energy supply chain, starting form photovoltaic cells (PV) and proceeding with energy extraction (harvest...
2011-06-01 - 2014-05-01 | Financiado

EPAMO: Energy-efficient piezo-MEMS tunable RF front-end antenna systems for mobile devices BOSCHMAN TECHNOLOGIES BV participó en un FP6: Future wireless communication systems need to cope with the increased number of frequency bands and advanced mobile phone standards supporti...
2011-04-01 - 2014-03-01 | Financiado

ESIP: Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test BOSCHMAN TECHNOLOGIES BV participó en un FP6: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
2010-05-01 - 2013-04-01 | Financiado

CAJAL4EU: Chip Architectures by Joint Associated Labs for European Diagnostics BOSCHMAN TECHNOLOGIES BV participó en un FP6: The main objective of the ENIAC JU project CAJAL4EU is to develop miniaturised biosensor technology platforms enabling diagnostic test manuf...
2010-03-01 - 2013-02-01 | Financiado

CSSL: Consumerizing Solid State Lighting BOSCHMAN TECHNOLOGIES BV participó en un FP6: Light-emitting diode (LED) lamps are a rapidly-emerging technology to replace incandescent light bulbs that is gaining acceptance as an alte...
2010-02-01 - 2013-01-01 | Financiado

SE2A: Nanoelectronics for Safe, Fuel Efficient and Environment Friendly Automotive Solutions BOSCHMAN TECHNOLOGIES BV participó en un FP6: The societal need for a transport infrastructure based upon the availability of safe, fuel-efficient and environmental-friendly cars is clea...
2009-01-01 - 2011-12-01 | Financiado

CAJAL4EU: Chip Architectures by Joint Associated Labs for European Diagnostics BOSCHMAN TECHNOLOGIES BV participó en un FP7: The main objective of the ENIAC JU project CAJAL4EU is to develop miniaturised biosensor technology platforms enabling diagnostic test manuf...
Financiado

CSSL: Consumerizing Solid State Lighting BOSCHMAN TECHNOLOGIES BV participó en un FP7: Light-emitting diode (LED) lamps are a rapidly-emerging technology to replace incandescent light bulbs that is gaining acceptance as an alte...
Financiado

ERG: ENERGY FOR A GREEN SOCIETY FROM SUSTAINABLE HARVESTING TO SMART DISTRIBUTION. EQUIPMENTS MATERIAL... BOSCHMAN TECHNOLOGIES BV participó en un FP7: The ERG project focus on the solar energy supply chain, starting form photovoltaic cells (PV) and proceeding with energy extraction (harvest...
Financiado

ESIP: Efficient Silicon Multi Chip System in Package Integration Reliability Failure Analysis and Test BOSCHMAN TECHNOLOGIES BV participó en un FP7: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
Financiado

MSP: Multi Sensor Platform for Smart Building Management BOSCHMAN TECHNOLOGIES BV participó en un FP7: The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and s...
Financiado

EPAMO: Energy efficient piezo MEMS tunable RF front end antenna systems for mobile devices BOSCHMAN TECHNOLOGIES BV participó en un FP7: Future wireless communication systems need to cope with the increased number of frequency bands and advanced mobile phone standards supporti...
Financiado

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