Innovating Works

AMIL

Desconocido
10ACe: 10 Angstrom CMOS exploration APPLIED MATERIALS ISRAEL LTD participó en un HORIZON EUROPE: HORIZON-KDT-JU-2023-1-IA The objective of the 10ÅCe pThe objective of the 10ÅCe project is to explore and realize solutions for the 10Å CMOS chip technology. Its con...
2024-05-17 - 2027-04-30 | Financiado
14AMI: 14 Angstroms Module Integration APPLIED MATERIALS ISRAEL LTD participó en un HORIZON EUROPE: HORIZON-KDT-JU-2022-1-IA The 14AMI project is about creating technological solutions for the 14 Angstrom CMOS technology node, including a fully integrated functiona...
2023-05-10 - 2026-04-30 | Financiado
14ACMOS: 14 Anstrom CMOS IC technology APPLIED MATERIALS ISRAEL LTD participó en un HORIZON EUROPE: HORIZON-KDT-JU-2021-1-IA 14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manuf...
2022-11-27 - 2025-11-30 | Financiado
MADEin4: Metrology Advances for Digitized ECS industry 4.0 APPLIED MATERIALS ISRAEL LTD tramitó un H2020: H2020-ECSEL-2018-1-IA-two-stage The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enha...
2019-05-21 - 2022-09-30 | Financiado
REACTION: first and euRopEAn siC eigTh Inches pilOt liNe APPLIED MATERIALS ISRAEL LTD participó en un H2020: H2020-ECSEL-2017-1-IA-two-stage REACTION will push through the first worldwide 200mm Silicon Carbide (SiC) Pilot Line Facility for Power technology. This will enable the Eu...
2018-05-18 - 2023-04-30 | Financiado
R3-PowerUP: 300mm Pilot Line for Smart Power and Power Discretes APPLIED MATERIALS ISRAEL LTD participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the Euro...
2017-05-15 - 2023-04-30 | Financiado
TAKEMI5: Technology Advances and Key Enablers for Module Integration for 5 nm APPLIED MATERIALS ISRAEL LTD participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to...
2017-05-15 - 2019-11-30 | Financiado
3DAM: 3D Advanced Metrology and materials for advanced devices APPLIED MATERIALS ISRAEL LTD participó en un H2020: H2020-ECSEL-2015-1-RIA-two-stage-Master The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the deve...
2016-04-14 - 2019-03-31 | Financiado
SeNaTe: Seven Nanometer Technology APPLIED MATERIALS ISRAEL LTD participó en un H2020: ECSEL-2014-2 The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm d...
2015-08-27 - 2018-03-31 | Financiado
PLACYD: Pilot Line For Self Assembly Copolymer Delivery APPLIED MATERIALS ISRAEL LTD participó en un FP6: The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main Euro...
2014-01-01 - 2017-01-01 | Financiado
PLACYD: Pilot Line For Self Assembly Copolymer Delivery APPLIED MATERIALS ISRAEL LTD participó en un FP7: The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main Euro...
Financiado
ENABLE450: Coordination Action to enable an effective European 450 mm Equipment Materials Network 5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm...
Financiado
SEA4KET: Semiconductor Equipment Assessment for Key Enabling Technologies APPLIED MATERIALS ISRAEL LTD participó en un FP7: SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D t...
Financiado
Bridge450: Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs Foundri... Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor pr...
Financiado
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