Innovating Works

AIS

Desconocido
TAKEMI5: Technology Advances and Key Enablers for Module Integration for 5 nm AIS AUTOMATION DRESDEN GmbH participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to...
2017-05-15 - 2019-11-30 | Financiado
E450EDL: European 450mm Equipment Demo Line AIS AUTOMATION DRESDEN GmbH participó en un FP7: The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm waf...
Financiado
EEMI 450: European 450mm Equipment Materials Initiative Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, m...
Financiado
EEM450PR: European E M 450mm Pilotline Readiness AIS AUTOMATION DRESDEN GmbH participó en un FP7: Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer...
Financiado
Bridge450: Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs Foundri... Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor pr...
Financiado
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