Innovating Works
iRel40: Intelligent Reliability 4.0 VEREIN ZUR FORDERUNG DER ELEKTRONENMIKROSKOPIE UND FEINSTRUKTURFORSCHUNG participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage Intelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failur...
2020-05-19 - 2023-10-31 | Financiado
ESTEEM3: Enabling Science and Technology through European Electron Microscopy VEREIN ZUR FORDERUNG DER ELEKTRONENMIKROSKOPIE UND FEINSTRUKTURFORSCHUNG participó en un H2020: H2020-INFRAIA-2018-2020 ESTEEM3 is an integrating activity for electron microscopy providing access to the leading European state-of-the-art electron microscopy res...
2018-12-03 - 2023-06-30 | Financiado
ESIP: Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test VEREIN ZUR FORDERUNG DER ELEKTRONENMIKROSKOPIE UND FEINSTRUKTURFORSCHUNG participó en un FP6: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
2010-05-01 - 2013-04-01 | Financiado
ESIP: Efficient Silicon Multi Chip System in Package Integration Reliability Failure Analysis and Test VEREIN ZUR FORDERUNG DER ELEKTRONENMIKROSKOPIE UND FEINSTRUKTURFORSCHUNG participó en un FP7: The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) soluti...
Financiado
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