Innovating Works

BESI

Desconocido
ARCTIC: Advanced Research on Cryogenic Technologies for Innovative Computing The rise of quantum technology has opened the eyes of the ICT industry with respect to cryogenics. It is considered an enabler bringing in q...
2024-06-11 - 2027-03-31 | Financiado
MATQu: Materials for Quantum Computing BESI AUSTRIA GMBH participó en un H2020: H2020-ECSEL-2020-2-RIA-two-stage Over the past 60+ years CMOS-based digital computing has giving rise to ever-greater computational performance, „big data-based business mod...
2021-05-12 - 2024-05-31 | Financiado
TINKER: FABRICATION OF SENSOR PACKAGES ENABLED BY ADDITIVE MANUFACTURING BESI AUSTRIA GMBH participó en un H2020: H2020-NMBP-TR-IND-2018-2020 The vision of TINKER is to provide a new cost- and resource efficient pathway for RADAR and LIDAR sensor package fabrication with high throu...
2020-09-23 - 2024-03-31 | Financiado
Moore4Medical: Accelerating Innovation in Microfabricated Medical Devices BESI AUSTRIA GMBH participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage Compared to the pace of innovation in electronic consumer products, the pace of innovation for medical devices is lagging behind. It is the...
2020-05-19 - 2023-09-30 | Financiado
CHARM: Challenging environments tolerant Smart systems for IoT and AI BESI AUSTRIA GMBH participó en un H2020: H2020-ECSEL-2019-1-IA-two-stage Digitalization has been identified as one of the key enablers for renewal and competitiveness of European manufacturing industries. However,...
2020-05-19 - 2024-02-29 | Financiado
APPLAUSE: Advanced packaging for photonics optics and electronics for low cost manufacturing in Europe BESI AUSTRIA GMBH participó en un H2020: H2020-ECSEL-2018-1-IA-two-stage The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufa...
2019-05-23 - 2022-10-31 | Financiado
R3-PowerUP: 300mm Pilot Line for Smart Power and Power Discretes BESI AUSTRIA GMBH participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the Euro...
2017-05-15 - 2023-04-30 | Financiado
EuroPAT-MASIP: European Packaging Assembly and Test Pilot for Manufacturing of Advanced System in Package BESI AUSTRIA GMBH participó en un H2020: H2020-ECSEL-2016-2-IA-two-stage Na
2017-05-12 - 2021-06-30 | Financiado
PowerBase: Enhanced substrates and GaN pilot lines enabling compact power applications BESI AUSTRIA GMBH participó en un H2020: ECSEL-2014-2 The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of...
2015-07-07 - 2018-06-30 | Financiado
PowerBase: Enhanced substrates and GaN pilot lines enabling compact power applications BESI AUSTRIA GMBH participó en un FP6: ECSEL-2014-2 The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of...
2015-05-01 - 2018-06-30 | Financiado
LAB4MEMS II: MOEMS:Micro-Optical MEMS, micro-mirrors and pico-projectors BESI AUSTRIA GMBH participó en un FP6: Micro-Optical MEMS, micro-mirrors and pico-projectors.Lab4MEMS II will feature the Pilot Line for innovative technologies on advanced Micro-...
2014-06-01 - 2017-06-01 | Financiado
LAB4MEMS II: MOEMS Micro Optical MEMS micro mirrors and pico projectors BESI AUSTRIA GMBH participó en un FP7: Micro-Optical MEMS, micro-mirrors and pico-projectors. Lab4MEMS II will feature the Pilot Line for innovative technologies on advanced Micro...
Financiado
Chip2Foil: Ultra thin chip integration process for low cost communicative polymer foils BESI AUSTRIA GMBH participó en un FP7: Chip2Foil aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a...
Financiado
* Datos extraídos de la documentos o webs disponibles en diferentes organismos públicos.