ExpectedOutcome:Projects are expected to contribute to at least three of the following outcomes:
Improved key metrics for communications (speed, power consumption, density) or for sensing (sensitivity, compactness, power consumption), making photonics ubiquitous in digital systems
New photonic-enabled sensing functions, not feasible with a technology platform based on a single material, or computing paradigms enabling new systems architectures (e.g. neuromorphic computing)
Vital contribution to Technological Sovereignty, Green Deal, Digital Transformation or Competitiveness which demonstrates new functionality, higher performance and more cost-effective systems across multiple application domains
Maintaining European technology leadership in the face of strong global competition
Scope:Proposals should address one of the following areas of activities:
Co-integration of photonics and microelectronics on single or multiple die (‘chiplet’ approach)Co-integration of multiple photonic IC material systems or components to address new wavelengths and sensor functions or new computing paradigms Proposals s...
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ExpectedOutcome:Projects are expected to contribute to at least three of the following outcomes:
Improved key metrics for communications (speed, power consumption, density) or for sensing (sensitivity, compactness, power consumption), making photonics ubiquitous in digital systems
New photonic-enabled sensing functions, not feasible with a technology platform based on a single material, or computing paradigms enabling new systems architectures (e.g. neuromorphic computing)
Vital contribution to Technological Sovereignty, Green Deal, Digital Transformation or Competitiveness which demonstrates new functionality, higher performance and more cost-effective systems across multiple application domains
Maintaining European technology leadership in the face of strong global competition
Scope:Proposals should address one of the following areas of activities:
Co-integration of photonics and microelectronics on single or multiple die (‘chiplet’ approach)Co-integration of multiple photonic IC material systems or components to address new wavelengths and sensor functions or new computing paradigms Proposals should demonstrate at least two use cases linked to commercial applications for example in computing, communications, robotic and autonomous systems, sensors or Internet of Things.
This topic implements the co-programmed European Partnership Photonics.
Specific Topic Conditions:Activities are expected to start at TRL 2 and achieve TRL 5 by the end of the project – see General Annex B.
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