IO-PR
Financiado
Silicon-Rich Materials for Advanced Semiconductor Fabrication
Semiconductor chips empower all modern digital technology and are an integral part of our lives. Only a handful of companies can produce them in their advanced forms or equipment and materials for the nanometers-scale precision re...
Semiconductor chips empower all modern digital technology and are an integral part of our lives. Only a handful of companies can produce them in their advanced forms or equipment and materials for the nanometers-scale precision required for their manufacture. To further improve semiconductor chips performance, a process called Extreme Ultraviolet lithography (EUVL) is required. PiBond is one of two companies globally who have innovated inorganic EUVL materials meeting future needs. Yet, the development of materials, which enable the formulation chip structures below 3nm node, is extremely challenging. It requires extreme molecular material control and outstanding quality and there is a myriad of challenges to overcome for a successful material and process. This high-risk project enables us to unlock a significant portion of advanced chips market of >500Bn€ and SAM of >3Bn€ in photoresist materials. Our project is critical for the EU goals in semiconductor manufacturing (Chips Act).
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Duración del proyecto: 24 meses
Fecha Inicio: 2023-07-24
Fecha Fin: 2025-07-31
Fecha Fin: 2025-07-31
Línea de financiación: concedida
El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2023-07-24
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
HORIZON-EIC-2023-ACCELERATOROPEN-01:
EIC Accelerator Open 2023
Cerrada
hace 1 año
Presupuesto
El presupuesto total del proyecto asciende a
4M€
Líder del proyecto
PIBOND OY
No se ha especificado una descripción o un objeto social para esta compañía.
175.61K€ |
Participante