Michele Dei
Michele Dei
Michele Dei received the Laurea degree cum Laude in Electronic Engineering and the Ph.D degree in Information Engineering at the University of Pisa (Italy) in 2007 and 2010, respectively, working on the design of smart sensors for detection of physical quantities.He is currently with IMB-CNM (Instituto de Microelectrónica de Barcelona - Centro Nacional de Microelectrónica, Spain). In 2017, he was with School of Information and Communication Technology at KTH (Royal Institute of Technology, Stockholm, Sweden) granted by a co-fund Marie Skłodowska-Curie action (TecnioSpringPlus) to work in smart packaging for wireless sensing of food safety and quality.His engineering background is that of low-power analog-mixed signal integrated circuit for sensor interfacing, data converters in the context of a number of high-impact research and industrial projects.Towards his consolidation as scientific senior he is actively seeking to increase his impact on society through participation to technological initiatives both as scientific coordinator and entrepreneur.
46 Trabajos publicados
Compañías
CONSEJO
No se ha especificado una descripción o un objeto social para esta compañía.
Universidad
Consejo Superior de Investigaciones Científicas - CSIC.
46 Trabajos publicados
Energy Efficiency in Slew-Rate Enhanced Single-Stage OTAs for Switched-Capacitor Applications.
Tecnologías
Analog-Mixed Signal
Perfil de ORCID
0000-0001-5388-0150