Innovating Works
UniSCool: UNISCOOL: SMART IN-CHIP LIQUID COOLING FOR ADVANCED MICROELECTRONIC SYSTEMS UNIVERSAL SMART COOLING SL tramitó un HORIZON EUROPE: HORIZON-EIE-2022-SCALEUP-02-02 The continuous increase in power density of integrated circuits due to the ever-increasing rate of data and communications and the constant...
2023-06-14 - 2024-06-30 | Financiado
HTCMP: Heterogeneous Chip Multiprocessor Design BILKENT UNIVERSITESI VAKIF tramitó un FP7: Increasing complexity of applications and their large dataset sizes make it imperative to consider novel architectures that are efficient fr...
Financiado
* Datos extraídos de la documentos o webs disponibles en diferentes organismos públicos.