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UniSCool

Financiado

UNISCOOL: SMART IN-CHIP LIQUID COOLING FOR ADVANCED MICROELECTRONIC SYSTEMS

The continuous increase in power density of integrated circuits due to the ever-increasing rate of data and communications and the constant push for size and cost reduction settles thermal management as a big concern for the ICT i... ver más

30/06/2024

UNIVERSAL SMART CO...

75K€

Presupuesto del proyecto: 75K€

Líder del proyecto

UNIVERSAL SMART COOLING SL Servicios técnicos de ingeniería y otras actividades relacionadas con el asesoramiento técnico sociedad limitada

TRL 4-5 | 50K€

Financiación concedida El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2024-06-30

Línea de financiación objetivo El proyecto se financió a través de la siguiente ayuda:

HORIZON-EIE-2022-SCALEUP-02-02: Women TechEU

Innovación

Cerrada hace 2 años

0% 100% 100%

1 Participantes

UNIVERSAL SMART COOLING SL

75.00K€ | Lider

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Últimas noticias

30-11-2024: Cataluña Gestión For... Se ha cerrado la línea de ayuda pública: Gestión Forestal Sostenible para Inversiones Forestales Productivas para el organismo:

29-11-2024: IDAE En las últimas 48 horas el Organismo IDAE ha otorgado 4 concesiones

29-11-2024: ECE En las últimas 48 horas el Organismo ECE ha otorgado 2 concesiones

Duración del proyecto: 12 meses Fecha Inicio: 2023-06-14
Fecha Fin: 2024-06-30

Líder del proyecto

UNIVERSAL SMART COOLING SL

TRL 4-5 | 50K€

Presupuesto del proyecto 75K€

Descripción del proyecto The continuous increase in power density of integrated circuits due to the ever-increasing rate of data and communications and the constant push for size and cost reduction settles thermal management as a big concern for the ICT industry. Consequently, cooling, with its enormous consumption of electricity and water has an increasingly large environmental impact, and new technologies to extract the heat in a more sustainable way are committed. A promising approach for more efficient thermal management is to directly embed liquid cooling inside the chip, eliminating the thermal resistance between the semiconductor die and the packaging. UniScool proposes a new patented and highly innovative liquid cooling system, based on an adaptive heat sink that includes a series of thermally activated fins capable of efficiently adapting the local heat extraction to time-dependent and non-uniform heat load scenarios, providing high-temperature uniformity without a custom design stage, avoiding overcooling and reducing the required pumping power, what provides an added-value solution that improves the existing ones. But with this project, we aim to go further and enter a new leading thermal management paradigm by developing an embedded liquid cooling system at the chip stack with the advantages of self-adaptive fins. This solution can boost the heat extraction capacity of the system up to more than 1kW/cm2 with significantly reduced flow rate and pumping power consumption (x 0.5), high performance, and significantly reduced space (x10) in a sustainable and environmentally friendly way. With Women TechEU, we aim to do a prototype demonstration of in-chip liquid cooling, embedded at the chip stack, based on a microchannel array with self-adaptive fins that regulate the local thermal resistance according to local temperature, which can be an open door for semiconductor manufacturers to believe in in-chip cooling and incorporate UniSCool solution in their microelectronic components.

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