UniSCool
Financiado
UNISCOOL: SMART IN-CHIP LIQUID COOLING FOR ADVANCED MICROELECTRONIC SYSTEMS
The continuous increase in power density of integrated circuits due to the ever-increasing rate of data and communications and the constant push for size and cost reduction settles thermal management as a big concern for the ICT i...
The continuous increase in power density of integrated circuits due to the ever-increasing rate of data and communications and the constant push for size and cost reduction settles thermal management as a big concern for the ICT industry. Consequently, cooling, with its enormous consumption of electricity and water has an increasingly large environmental impact, and new technologies to extract the heat in a more sustainable way are committed. A promising approach for more efficient thermal management is to directly embed liquid cooling inside the chip, eliminating the thermal resistance between the semiconductor die and the packaging.
UniScool proposes a new patented and highly innovative liquid cooling system, based on an adaptive heat sink that includes a series of thermally activated fins capable of efficiently adapting the local heat extraction to time-dependent and non-uniform heat load scenarios, providing high-temperature uniformity without a custom design stage, avoiding overcooling and reducing the required pumping power, what provides an added-value solution that improves the existing ones. But with this project, we aim to go further and enter a new leading thermal management paradigm by developing an embedded liquid cooling system at the chip stack with the advantages of self-adaptive fins. This solution can boost the heat extraction capacity of the system up to more than 1kW/cm2 with significantly reduced flow rate and pumping power consumption (x 0.5), high performance, and significantly reduced space (x10) in a sustainable and environmentally friendly way.
With Women TechEU, we aim to do a prototype demonstration of in-chip liquid cooling, embedded at the chip stack, based on a microchannel array with self-adaptive fins that regulate the local thermal resistance according to local temperature, which can be an open door for semiconductor manufacturers to believe in in-chip cooling and incorporate UniSCool solution in their microelectronic components.
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Duración del proyecto: 12 meses
Fecha Inicio: 2023-06-14
Fecha Fin: 2024-06-30
Fecha Fin: 2024-06-30
Línea de financiación: concedida
El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2024-06-30
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
HORIZON-EIE-2022-SCALEUP-02-02:
Women TechEU
Cerrada
hace 2 años
Presupuesto
El presupuesto total del proyecto asciende a
75K€
Líder del proyecto
UNIVERSAL SMART COOLING SL
Servicios técnicos de ingeniería y otras actividades relacionadas con el asesoramiento técnico sociedad limitada
Perfil tecnológico
TRL
4-5
Perfil tecnológico
TRL
4-5