ROODMICROTEC
Desconocido
APPLAUSE: Advanced packaging for photonics optics and electronics for low cost manufacturing in Europe
ROODMICROTEC GMBH
participó en un
H2020
H2020-ECSEL-2018-1-IA-two-stage
The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufa...
2019-05-23 - 2022-10-31 | Financiado
2019-05-23 - 2022-10-31 | Financiado
EuroPAT-MASIP: European Packaging Assembly and Test Pilot for Manufacturing of Advanced System in Package
ROODMICROTEC GMBH
participó en un
H2020
H2020-ECSEL-2016-2-IA-two-stage
Na
2017-05-12 - 2021-06-30 | Financiado
2017-05-12 - 2021-06-30 | Financiado
* No se disponen de datos de la empresa actual.