Innovating Works
PhotonicLEAP: Photonic Wafer Level Integration Packaging and Test FICONTEC IRELAND LIMITED participó en un H2020: H2020-ICT-2018-20 PhotonicLEAP will develop a disruptive wafer-level PIC module integration, packaging and test technology which can be scaled from low to ver...
2020-11-30 - 2024-12-31 | Financiado
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