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PhotonicLEAP

Financiado

Cerrado

Photonic Wafer Level Integration Packaging and Test

PhotonicLEAP will develop a disruptive wafer-level PIC module integration, packaging and test technology which can be scaled from low to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutiona... ver más

31/12/2024

UCC

6M€

Presupuesto del proyecto: 6M€

Líder del proyecto

UNIVERSITY COLLEGE CORK NATIONAL UNIVERSITY... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 8 Participantes

Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2024-12-31

ICT-36-2020: Disruptive photonics technologies

I+D

Cerrada hace 4 años

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Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

8 Participantes

UCC

1.13M€ | Lider

BOSCH

280.00K€ | Participante

LPKF

550.00K€ | Participante

Fraunhofer

1.55M€ | Participante

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Duración del proyecto: 49 meses Fecha Inicio: 2020-11-30
Fecha Fin: 2024-12-31

Líder del proyecto

UNIVERSITY COLLEGE CORK NATIONAL UNIVERSITY... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 6M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto PhotonicLEAP will develop a disruptive wafer-level PIC module integration, packaging and test technology which can be scaled from low to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutionary Surface Mount Technology (SMT) PIC package, which for the first time incorporates multiple optical and electrical connections. SMT is the most widely used, cost-effective and standardised package in the electronics world and PhotonicLEAP’s standardised SMT approach is set to follow, becoming a new global standard for cost-effective PIC packaging and high-throughput PIC testing. PhotonicLEAP will also develop standardised packaging design rules formalised into a Process Design Kit (PDK), providing users with easy access to the project technology through Open Access and commercial PIC design software tools. The project will validate these technologies through two state-of-the-art demonstrators, including a high-speed optical communication module and a portable medical device for cardio-vascular diagnostics. PhotonicLEAP’s approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and creating completely new markets. The project workplan includes high-quality measures to Exploit and Disseminate PhotonicLEAP’s results, including management of IP and research data, and to Communicate project activities to different target audiences. A key exploitation measure involves technology transfer to the flagship European PIC Packaging Pilot Line, PIXAPP, which has an extensive and growing user-base across multiple markets. PhotonicLEAP will be delivered by a highly experienced consortium with an unmatched record of excellence in developing and delivering many world firsts in PIC packaging, test technologies and advanced services. The consortium brings a wealth of interdisciplinary skills and state-of-the-art infrastructure to deliver on the project’s ambitious objectives.

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