APC
Desconocido
PowerizeD: Digitalization of Power Electronic Applications within Key Technology Value Chains
The overarching goal of PowerizeD is to develop breakthrough technologies of digitalized and intelligent power electronics, in order to enab...
2022-12-01 - 2025-12-31 | Financiado
2022-12-01 - 2025-12-31 | Financiado
Power2Power: The next generation silicon based power solutions in mobility industry and grid for sustainable dec...
ADVANCED PACKAGING CENTER BV
participó en un
H2020:
H2020-ECSEL-2018-1-IA-two-stage
The objectives in Power2Power aim to foster a holistic, digitized pilot line approach by accelerating the transition of ideas to innovations...
2019-05-24 - 2022-09-30 | Financiado
2019-05-24 - 2022-09-30 | Financiado
APPLAUSE: Advanced packaging for photonics optics and electronics for low cost manufacturing in Europe
ADVANCED PACKAGING CENTER BV
participó en un
H2020:
H2020-ECSEL-2018-1-IA-two-stage
The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufa...
2019-05-23 - 2022-10-31 | Financiado
2019-05-23 - 2022-10-31 | Financiado
INLINETEST: In line quality inspection system for smart production of micro and nanoelectronic components
ADVANCED PACKAGING CENTER BV
participó en un
H2020:
H2020-ICT-2016-2017
Future micro/nano-electronics components production will need to be smart and provide instantaneous information on all items for complete tr...
2017-09-21 - 2021-11-30 | Financiado
2017-09-21 - 2021-11-30 | Financiado
R3-PowerUP: 300mm Pilot Line for Smart Power and Power Discretes
ADVANCED PACKAGING CENTER BV
participó en un
H2020:
H2020-ECSEL-2016-2-IA-two-stage
R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the Euro...
2017-05-15 - 2023-04-30 | Financiado
2017-05-15 - 2023-04-30 | Financiado
HIOS: Highly Integrated Optoelectronic Sensor
ADVANCED PACKAGING CENTER BV
participó en un
H2020:
H2020-FTIPilot-2015-1
HIOS (Highly Integrated Optoelectronic Sensor) aims to develop and to launch world’s first light sensor with fully integrated optical stack....
2016-07-24 - 2019-07-31 | Financiado
2016-07-24 - 2019-07-31 | Financiado
IoSense: Flexible FE BE Sensor Pilot Line for the Internet of Everything
ADVANCED PACKAGING CENTER BV
participó en un
H2020:
H2020-ECSEL-2015-2-IA-two-stage-Master
The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and cre...
2016-05-04 - 2019-04-30 | Financiado
2016-05-04 - 2019-04-30 | Financiado
SAFESENS: Sensor technologies enhanced safety and security of buildings and its occupants
ADVANCED PACKAGING CENTER BV
participó en un
FP6:
During our life’s, both privately and professionally, we exposed to a multitude of hazardous situations. And most of the time we are not (ti...
2014-04-01 - 2017-04-01 | Financiado
2014-04-01 - 2017-04-01 | Financiado
SAFESENS: Sensor technologies enhanced safety and security of buildings and its occupants
ADVANCED PACKAGING CENTER BV
participó en un
FP7:
During our life’s, both privately and professionally, we exposed to a multitude of hazardous situations. And most of the time we are not (ti...
Financiado
Financiado
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