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HOLISTEP

Financiado

SUB-WAVELENGTH HOLOGRAPHIC LITHOGRAPHY STEPPER FOR INTEGRATED CIRCUIT PRODUCTION

To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to... ver más

31/12/2027

Fraunhofer

4M€

Presupuesto del proyecto: 4M€

Líder del proyecto

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANG... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Ver 9 Participantes

Financiación concedida El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2023-12-04

Línea de financiación objetivo El proyecto se financió a través de la siguiente ayuda:

HORIZON-CL4-2023-TWIN-TRANSITION-01-02: High-precision OR complex product manufacturing – potentially including the use of photonics (Made in Europe and Photonics Partnerships) (IA)

I+D +1

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9 Participantes

Fraunhofer

1.37M€ | Lider

EKSPLA

282.04K€ | Participante

CAPGEMINI ENGINEERING DEUTSC...

388.84K€ | Participante

MODUS RESEARCH AND INNOVATIO...

N.D. | Participante

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Últimas noticias

25-11-2024: ECE En las últimas 48 horas el Organismo ECE ha otorgado 52 concesiones

25-11-2024: CMVAMADRID En las últimas 48 horas el Organismo CMVAMADRID ha otorgado 1 concesiones

25-11-2024: FUNDACION-EOI En las últimas 48 horas el Organismo FUNDACION EOI ha otorgado 6 concesiones

Duración del proyecto: 48 meses Fecha Inicio: 2023-12-04
Fecha Fin: 2027-12-31

Presupuesto del proyecto 4M€

Descripción del proyecto To achieve ever shrinking dimensions and higher resolutions of circuit elements, projection lithography (PL), is growing in complexity and cost to manufacturers. It is limited to producing 2D images on flat surfaces. Extension to 3D imaging is restricted by trade-off between focus depth and resolution. Advanced, cost-efficient solutions to fabricate wafer-scale 3D components are required. HoLiSTEP unleashes the potential of sub-wavelength Holographic Lithography (HL) as a powerful and enabling disruptive lithography. HL will overcome limitations of PL and facilitate production of novel 3D topographies with high resolution while making the production of high-resolution IC much more affordable. An industrial prototype operating at 345nm with 200nm resolution will be produced and validated in an operational environment. Several advancements in holographic stepper subcomponents must be realised: A UV fibre-based laser with 20W output power at 345nm and 1.5m coherence length, an alignment system with 25nm overlay precision, an adaptive optical system with correction precision of 1/20λ and software modules for vector diffraction models. Energy consumption of HL technology is drastically reduced compared to PL due to low power-consumption of the laser and production of complex structures in one exposure. HL images are not sensitive to mask defects, eliminating frequent mask replacements and use of toxic materials. Moreover, holographic masks act as projection optics, eliminating the need for complex optical systems. The HL prototype will be verified for 3D patterning for MEMS, MOEMS and micro-optical components to show better resolution, flexibility of 3D printing and reduced cost. HoLiSTEP will empower a positive transformative effect on environment, economy and society by enabling a wider range of companies to produce novel high-resolution 2D and 3D images at lower costs.

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