Hola,
¿eres nuevo aquí?

Regístrate gratis y conecta tu empresa con financiación pública, partners y proyectos.

Tengo cuenta

Regístrate

Ver video

IC2020

Financiado

Cerrado

Speeding up intra system data transfer through optical data links and minimizing...

Speeding up intra system data transfer through optical data links and minimizing energy demand by a new generation of integrated circuits The application of cutting-edge technologies like AR/VR or artificial intelligence in consumer products and industry demand for high-performance data transfer between processors, memory and peripherals. This is valid for e.g. self... ver más

26/11/2021

VIS

135K€

Presupuesto del proyecto: 135K€

Líder del proyecto

VI SYSTEMS GMBH No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2021-11-26

INNOSUP-02-2019-2020: European SME innovation Associate -...

I+D

Cerrada hace 6 años

0% 100% 100%

Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

1 Participantes

VIS

135.00K€ | Lider

Proyectos interesantes

SPIKEPro

Electronics

Software

2M€ Cerrado

PHOENICS

Software

Electronics

6M€ Cerrado

DYNAMOS

Electronics

Software

6M€ Cerrado

MY-CUBE

Electronics

Software

3M€ Cerrado

PHRESCO

Software

Electronics

3M€ Cerrado

NEWPhotonics

Electronics

Data Science

4M€ Cerrado

Conecta tu I+D

¿Tienes un proyecto y buscas un partner? Gracias a nuestro motor inteligente podemos recomendarte los mejores socios y ponerte en contacto con ellos. Te lo explicamos en este video

Duración del proyecto: 14 meses Fecha Inicio: 2020-08-28
Fecha Fin: 2021-11-26

Líder del proyecto

VI SYSTEMS GMBH No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 135K€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto The application of cutting-edge technologies like AR/VR or artificial intelligence in consumer products and industry demand for high-performance data transfer between processors, memory and peripherals. This is valid for e.g. self-driving cars but also for industrial data centres. However, the limiting factor nowadays (and for future scaling) is the data transfer within the system, specifically, by the factors: bandwidth, power, and space. In fact, so-called interconnects cause 30% of power consumption in data centres today (and data centres account for currently 2%, in the future estimated 8%, of electricity worldwide). At higher speeds, the electricity cost of currently used copper links already dominates over the hardware cost. Due to this and their unsustainable signal loss, copper links are increasingly replaced by optical solutions, e.g. vertical-cavity surface-emitting laser (VCSEL), which provide negligible frequency dependent loss, a high bandwidth and 10-times lower power consumption. The VIS team has repeatedly reached performance world records for their VCSEL products based on proprietary transmitter and receiver assemblies and own integrated circuits (ICs). Facing the challenge of continued scaling and data transmission capacity needs >200Gb/s, the industry needs a new generation of VCSEL chips. To develop those, some further optimized ICs are most important. Currently, IC development is outsourced by VIS with a significant supervising effort. Main objective of this proposal is to hire and integrate an IC design expert to finally extend IC performance in VIS VCSELs to enable 224Gb/s PAM4 single channel transmission at energy consumption of 1mW/Gbps (triple speed performance and -50% energy demand). The VIS business opportunity is to provide complete proprietary VCSEL solutions, triplicating the revenues and gaining a market share of >20 % of the datacom segment of this market within 5y. The innovation associate will gain a long-term career opportunity.

Conecta tu I+D

Entra hoy

¿Olvidé mi contraseña?

Financiación

Empresas

CTIs/Universidades

Proyectos

Investigadores