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MIANT

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Monolithic Integrated Antennas

The wired chip-to-chip and on-chip interconnects limit the performance of modern integrated circuits. An interesting technique or avoiding this bottleneck is the implementation of wireless intra- and inter-chip interconnects. An e... ver más

31/08/2015

TECHNICAL UNIVERSI...

100K€

Presupuesto del proyecto: 100K€

Líder del proyecto

TECHNICAL UNIVERSITY OF SOFIA No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2015-08-31 No tenemos la información de la convocatoria

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1 Participantes

TECHNICAL UNIVERSITY OF SOFI...

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Líder del proyecto

TECHNICAL UNIVERSITY OF SOFIA No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 100K€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto The wired chip-to-chip and on-chip interconnects limit the performance of modern integrated circuits. An interesting technique or avoiding this bottleneck is the implementation of wireless intra- and inter-chip interconnects. An efficient wireless link between two or more integrated circuits requires the integration of the transceiver circuitry, as well as the antennas. The latest CMOS technology generations support integration of high-frequency circuitry well into the millimetre-wave range. An area-efficient way to integrate the antennas is to share chip area between the integrated circuit and the antenna. This is achieved by cutting the circuitry ground supply plane into patches and using these patches as antenna electrodes. Here it is assumed that the circuit ground plane is manufactured in the top metallisation layer of the CMOS process. The goal of the project is to investigate the monolithic integrated antennas using the CMOS circuit ground plane as antenna electrodes. The antenna input impedance will be evaluated numerically and experimentally for various antenna geometries. The influence of the substrate and the chip dicing in the antenna radiation parameters will be studied. The interference between the integrated CMOS digital circuits and the wireless chip-to-chip link will be estimated. These studies will give sound theoretical basis for the implementation of wireless chip-to-chip interconnects. The project will be an important step in the career development of the applicant. He will be joining a leading research institution, where he will be managing his own projects and will be involved in teaching activities. The applicant is moving from Germany - a country with sound reputation in science and research, to his home country of Bulgaria. There is a huge potential for transfer of both technical and administrative knowledge to the host institution and enhancement in the networking opportunities for development of an innovation society throughout the Union.

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