Hola,
Are you new here?

COMAP-4S

financed

COmponents and MAcrocomponents Packaging For Space

Space markets have entered a new age, thanks to new business models but also to the increased use of deeply integrated electronics aboard satellites, either for digital or analog functions. Such miniaturized equipment allows for d... see more

30/06/2024

SAFRAN ELECTRONICS...

3M€

Project Budget: 3M€

Project leader

SAFRAN ELECTRONICS DEFENSE No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

Ver 5 Participantes

Financing granted El organismo H2020 notifico la concesión del proyecto The day 2024-06-30

SPACE-10-TEC-2018-2020: Technologies for European non-depen... Specific Challenge:The space sector is a strategic asset contributing to the independence, security...

I+D

Cerrada does 7 years

0% 99% 100%

characteristics of the participant

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Private Information

No hay información privada compartida para este proyecto. Habla con el coordinador.

5 Participantes

SAFRAN ELECTRONICS DEFENSE

1.71M€ | Leader

CALDERERIA QUINTIN

TUB

499.00K€ | participant

ACB

442.03K€ | participant

Conecta tu I+D

¿Tienes un proyecto y buscas un partner? Gracias a nuestro motor inteligente podemos recomendarte los mejores socios y ponerte en contacto con ellos. Te lo explicamos en este video

Project duration: 54 months Date Start: 2019-12-20
End date: 2024-06-30

Project leader

SAFRAN ELECTRONICS DEFENSE No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 3M€

participation deadline Sin fecha límite de participación.

Project description Space markets have entered a new age, thanks to new business models but also to the increased use of deeply integrated electronics aboard satellites, either for digital or analog functions. Such miniaturized equipment allows for drastic reductions of the satellite mass, thus enabling larger payloads and more service revenues, and/or lighter satellites, and then cheaper launches. However, despite the deep submicron technologies currently used for manufacturing space components, efficient and competitive packaging of large components remains a roadblock in trying to downsize further these equipment. This is especially true when we have to address dies beyond 300 mm² and/or beyond 625 pins, such integration being made worse with ever increased power dissipation, up to 10 or 20 W per die. Following-up innovative approaches already developed by the Consortium members, such as European rad-hard FPGA (e.g. BRAVE, DAHLIA, OR VEGAS/OPERA projects), System In Package (SIP) technologies and High Density PCB as experienced with ESA contracts, the principal objective of this project is to design and ECSS qualify a macro-component Demonstration Model (DM) for space applications, offering unmatched Figures of Merit for space packaging, in terms of Interconnexion density, Die surface, Integration density, together with a cost reduction factor of 3 compared to ceramic CGA, among others. These challenges are made reachable within a 3-phase program, leveraging advanced technologies in organic high density low CTE PCBs, innovative thermal management and SIP integration up to a TRL7 stage, validating the full industrial processes vs. the ECSS Q ST standards. Furthermore, thanks to the close partnership we have in our Consortium, this COMAP-4S Project will set the stage for a true European supply chain serving additional markets beyond rad-hard space equipment, such as embedded macro-components for Defense or Aeronautics, being fully in line with the objectives of SPACE-10-TEC-2019.

Conecta tu I+D

Entra hoy

Forgot your password?

Financing

Companies

CTIs/Universidades

Projects

researchers