WInSiC4AP
Financiado
Wide band gap Innovative SiC for Advanced Power
WInSiC4AP core objective is to contribute in developing reliable technology bricks for efficient and cost-effective applications addressing social challenges and market segments where Europe is a recognized global leader as well a...
WInSiC4AP core objective is to contribute in developing reliable technology bricks for efficient and cost-effective applications addressing social challenges and market segments where Europe is a recognized global leader as well as automotive, avionics, railway and defence.
WInSiC4AP approach is to rely on the strength of vertical integration allowing optimization, technologies fitting application requirements, developing the full ecosystem and approach relevant issues as reliability in the full scope. That enhances the competitiveness of EU- Industries as well as TIER1 and TIER2 down to the value chain in a market context where other countries today, such as the USA or Japan, are advancing and new players accessing SiC enter in the market.
New topologies and architecture will be developed for targeted application simulating operational environment, at laboratory level, driving the needed and still missed technologies, components and demonstrators to fill the gap between current state of the art and the very high demanding specifications.
WInSiC4AP framework has been built so that companies working in different domains (i.e. automotive car maker and TIER1-2 and avionics, railway and defence TIER1-TIER2) and in the vertical value chain (semiconductor suppliers, companies manufacturing inductors and capacitors) as well as academic entities and laboratories will collaborate to co-design solutions, solve problems and exchange know-how, such that unforeseen results may also emerge.
WInSiC4AP will be supported with synergy between ECSEL JU and ESI funding enabling complementary activities with relevant economic and social impact envisage in a less development region of Union.
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Duración del proyecto: 46 meses
Fecha Inicio: 2017-05-19
Fecha Fin: 2021-03-31
Fecha Fin: 2021-03-31
Línea de financiación: concedida
El organismo H2020 notifico la concesión del proyecto el día 2021-03-31
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
ECSEL-2016-1:
ECSEL Key Applications and Essential technologies (RIA)
Cerrada
hace 8 años
Presupuesto
El presupuesto total del proyecto asciende a
28M€
Líder del proyecto
DISTRETTO TECNOLOGICO SICILIA MICROE NANO SIS...
No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico
TRL
4-5
Perfil tecnológico
TRL
4-5
672.74K€ |
Participante