LO-KMOF
Financiado
Vapour deposited metal organic frameworks as high performance gap filling dielec...
Vapour deposited metal organic frameworks as high performance gap filling dielectrics for nanoelectronics
Since the invention of integrated circuits, there has been a persistent incentive towards miniaturization. An indispensable part of every chip is a multi-level wiring system fabricated on top of the semiconductor layer containing...
Since the invention of integrated circuits, there has been a persistent incentive towards miniaturization. An indispensable part of every chip is a multi-level wiring system fabricated on top of the semiconductor layer containing the transistors. As transistors get smaller and more densely packed, the complexity and the impact on performance of the on-chip interconnects rises. The non-zero resistance and capacitance associated with the metal wires and the dielectric medium between them induce cross-talk noise between adjacent interconnects, limit the speed of signal propagation and increase the power consumption of a chip.
The LO-KMOF project proposes an approach to alleviate these issues by integrating for the first time metal-organic frameworks as an interconnect dielectric. The project will make use of a novel vapour phase deposition approach for these materials, developed in the ERC project VAPORE. If successful, the project will contribute to chips that are not only faster but also consume less power. The proposed technology will be validated in an industrially relevant demonstrator.
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Duración del proyecto: 18 meses
Fecha Inicio: 2019-08-28
Fecha Fin: 2021-02-28
Fecha Fin: 2021-02-28
Línea de financiación: concedida
El organismo H2020 notifico la concesión del proyecto el día 2021-02-28
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
ERC-2019-POC:
ERC Proof of Concept Grant
Cerrada
hace 5 años
Presupuesto
El presupuesto total del proyecto asciende a
150K€
Líder del proyecto
KATHOLIEKE UNIVERSITEIT LEUVEN
No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico
TRL
4-5
Perfil tecnológico
TRL
4-5
206.25K€ |
Participante