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BOOM

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Terabit on chip nmicro and nano scale silicon photonic integrated components an...

Terabit on chip nmicro and nano scale silicon photonic integrated components and sub systems enabling Tb s capacity scalable and fully integrated photonic routers BOOM is an integration project that aims to pursue the systematic advancement of Silicon-on-Insulator (SOI) integration technology to develop compact, cost-effective and power efficient silicon photonic components that enable phot... see more

30/09/2011

RESEARCH UNIVERSIT...

4M€

Project Budget: 4M€

Project leader

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

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Financing granted El organismo FP7 notifico la concesión del proyecto The day 2011-09-30 We do not have the information of the call

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characteristics of the participant

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Private Information

No hay información privada compartida para este proyecto. Habla con el coordinador.

10 Participantes

RESEARCH UNIVERSITY INSTITUT...

0.00€ | Leader

TIM

N.D. | participant

LIONIX BV

N.D. | participant

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Project leader

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 4M€

participation deadline Sin fecha límite de participación.

Project description BOOM is an integration project that aims to pursue the systematic advancement of Silicon-on-Insulator (SOI) integration technology to develop compact, cost-effective and power efficient silicon photonic components that enable photonic Tb/s capacity systems for current and new generation high speed broadband core networks. BOOM develops fabrication techniques as well as flip-chip bonding and wafer-scale integration methods to fabricate and mount the complete family of III-V components on SOI boards including: arrays of Semiconductor Optical Amplifiers, monolithic blocks of Electro-absorption modulated lasers (EMLs) and highly efficient photodetectors. As such the BOOM SOI optical board technology will be able to blend the cost-effectiveness and integration potential of silicon with the high bandwidth and processing power of III-V material and provide a new generation of functional and miniaturized photonic components including: (a) a single 160 Gb/s SOI Wavelength Converter (WC) and a quadruple array of 160 Gb/s WCs with a record chip throughput of 640 Gb/s on a size 20x5 mm2 , (b) a compact, eight channel, ultra dense WDM InAlAs-InGaAs photoreceiver with record high responsivity and (c) a dual SOI EML transmitter together with its electronic drivers on a single chip. In addition, BOOM invests in the development of improved CMOS compatible waveguide technologies to fabricate miniaturized, low loss and fully reconfigurable wavelength routing cross-connects based on two dimensional grids of serially interconnected micro-ring resonators. BOOM will perform system level integration of all these components to assemble the first prototype rack-mount, ultra-high capacity routing platform based on silicon photonics that will require minimum board space and power consumption and achieve a total throughput of 640 Gb/s. The platform will be evaluated in a network operator test bed employing GbE optical signals.

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