Innovating Works

SLAM-DAST

Financiado
Smart LightwAve Multi modal Distributed Acoustic Strain and Temperature sensor...
Distributed Acoustic Sensing (DAS) and Distributed Temperature-Strain Sensing (DTSS) are two ground-breaking Distributed Fibre Optic Sensor (D-FOS) technologies that allow large-scale measuring and mapping of acoustic vibrations,... Distributed Acoustic Sensing (DAS) and Distributed Temperature-Strain Sensing (DTSS) are two ground-breaking Distributed Fibre Optic Sensor (D-FOS) technologies that allow large-scale measuring and mapping of acoustic vibrations, temperature, mechanical deformations, and pressure in a large variety of consumer-based, civil, industrial, and environmental applications, in particular for attaining the widespread technological nerve system in smart city environments, for instance in smart home/household monitoring (heating, survelliance, fire detection, structural heath, and so forth), as well as in product distribution/logistics (traffic, distribution and plant monitoring). DAS and DTSS employ a low-priced optical fibre cable installed along the assets (e.g. homes/households in a neighborhood) to be monitored for up to 100 km through an interrogator equipment that sweeps a virtual sensor to measure the physical parameters individually at any cable point. This project main objective is to develop, prototype and demonstrate, both in civil/industrial and especially in household/smart-city case studies, a new, cost-effective, Smart LightwAve Multi-modal Distributed Acoustic Strain and Temperature photonic sensing system (SLAM-DAST), which will integrate: - Distributed Temperature and mechanical deformation (Strain) Sensing (DTSS) and - Distributed Acoustic vibrations optical Sensing (DAS) SLAM-DAST aims at securing the conditions of a disruptive market exploitation, at an industrial as well as at a large scale consumer-oriented level, of the project’s results by: - supporting the product characterisation-standardisation through open access to performance test benches; - adopting open innovation policies about general system architecture and embedded data pre-processing; - promoting vendor interoperability through the use of open standards and formats; - creating shared value through knowledge-spreading and international networking with key market access points. ver más
30/06/2024
CNR
3M€
Duración del proyecto: 39 meses Fecha Inicio: 2021-03-03
Fecha Fin: 2024-06-30

Línea de financiación: concedida

El organismo H2020 notifico la concesión del proyecto el día 2024-06-30
Línea de financiación objetivo El proyecto se financió a través de la siguiente ayuda:
EIC-FTI-2018-2020: Fast Track to Innovation (FTI)
Cerrada hace 6 años
Presupuesto El presupuesto total del proyecto asciende a 3M€
Líder del proyecto
CONSIGLIO NAZIONALE DELLE RICERCHE No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico TRL 4-5