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POLYSYS

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POLYSYS Direct 100G connectivity with optoelectronic POLYmer InP integration fo...

POLYSYS Direct 100G connectivity with optoelectronic POLYmer InP integration for data center SYstems Optical connectivity in data centers relies on 10Gb/s parallel optics that raise scalability and energy consumption issues. Efforts towards advanced modulation formats pose severe system complexity. The upgrade to 100 Gb/s to reso... ver más

31/01/2014

RESEARCH UNIVERSIT...

4M€

Presupuesto del proyecto: 4M€

Líder del proyecto

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

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Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2014-01-31 No tenemos la información de la convocatoria

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5 Participantes

RESEARCH UNIVERSITY INSTITUT...

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TEO

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Líder del proyecto

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 4M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto Optical connectivity in data centers relies on 10Gb/s parallel optics that raise scalability and energy consumption issues. Efforts towards advanced modulation formats pose severe system complexity. The upgrade to 100 Gb/s to resolve the bandwidth bottleneck and increase the throughput of optical interconnect backplanes requires a disruptive yet straightforward solution. POLYSYS aims to provide this solution and realize 100Gb/s serial connectivity for rack-to-rack and chip-to-chip interconnects. POLYSYS will use electro-optic polymer as an integration platform where 100Gb/s modulators will be integrated monolithically, whereas InP lasers, detectors and electronics will be integrated hybridly. The InP-to-polymer integration technique will enable 95% coupling efficiency without using lenses and bulk optics. POLYSYS will fabricate the first serial 100Gb/s and 4x100Gb/s transmitters integrated with <1W-consuming electronic driver ICs, achieving 10 times higher line rates than mainstream 10 Gb/s VCSEL or silicon-based commercial products. POLYSYS will furthermore integrate 4x100Gb/s optoelectronic receivers monolithically in InP. The receivers will exhibit a high conversion gain to enable direct connectivity without optical amplifiers. The electronics will be integrated in arrays and the DEMUX circuit will demonstrate record low sensitivity. POLYSYS will demonstrate 4x100Gb/s direct data interconnection, increasing by 4 times the total throughput and reducing at least by a factor of 2 the required Energy/bit with respect to commercially available products. By demonstrating optical demultiplexing based on polymer, POLYSYS will show that the energy/bit can be further decreased by a factor of 5. Finally, POLYSYS will demonstrate serial 100Gb/s chip-to-chip interconnection by integrating transmitter and receiver at both ends of a polymer waveguide chip. As such POLYSYS will show compatibility with polymer backplanes and provide the technology for a tenfold capacity upgrade.

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