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POLYNICES

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POLYmer based electro-optic PCB motherboard integration with Si3N4 Chiplets, InP...

POLYmer based electro-optic PCB motherboard integration with Si3N4 Chiplets, InP Components and Electronic ICs enabling affordable photonic modules for THz Sensing and quantum computing appl Despite the significant advances that photonic integrated circuits (PICs) offer in terms of miniaturization, power consumption and functionalities, they run into scalability and cost issues, related to the fabrication yield, the i... see more

30/06/2026

RESEARCH UNIVERSIT...

5M€

Project Budget: 5M€

Project leader

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

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Financing granted El organismo HORIZON EUROPE notifico la concesión del proyecto The day 2022-12-07

HORIZON-CL4-2021-DIGITAL-EMERGING-01-12: European Network of Excellence Cent... Expected Outcome:Proposal results are expected to contribute to all the following expected outcomes:

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Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

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8 Participantes

RESEARCH UNIVERSITY INSTITUT...

723.75K€ | Leader

OPTAGON PHOTONICS PRIVATE CO...

261.98K€ | participant

Fraunhofer

1.66M€ | participant

PHIX BV

479.38K€ | participant

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Project duration: 42 months Date Start: 2022-12-07
End date: 2026-06-30

Project leader

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 5M€

participation deadline Sin fecha límite de participación.

Project description Despite the significant advances that photonic integrated circuits (PICs) offer in terms of miniaturization, power consumption and functionalities, they run into scalability and cost issues, related to the fabrication yield, the increased integration and packaging complexity, the lack of wafer scale compatible processes and the lack of integration and packaging standards. Furthermore, so far photonic packaging considered the sub-GHz electrical connections to the PICs as a separate and second priority issue, until the number of electrical IOs of the PICs was too large to ignore. POLYNICES aims to address these challenges with the development of a novel general purpose photonic integration technology, compatible with wafer scale processes that will reduce the production costs of photonic modules by at least 10x. POLYNICES will develop for the first time a polymer based Electro-Optic PCB (EOPCB) motherboard that will host Si3N4 chiplets, InP components and micro-optical elements. POLYNICES invests in Si3N4 platform with PZT actuators to realize complex structures in only 1x1 cm2 chiplets with ultra-low power consumption. The chiplets’ grid array electrical pads and the use of flip-chip integration on vertical alignment stops will allow optical alignment and electrical connection in one step. The standard size and interfaces of the chiplets as well as the electronic IC co-packaging on the same EOPCB, provides excellent scalability and customization, and significantly simplifies packaging. Dielectric rod THz antennas will be integrated on the EOPCB taking advantage of its good HF properties. Using the above novel concepts and building blocks, POLYNICES will develop a fully integrated optoelectronic FMCW THz spectrometer with THz antenna array and beam steering abilities for quality control in plastics, a 16x16 quantum processor with integrated 780 nm light source and non-linear crystals and a 24x24 quantum processor with integrated squeezed light state source.

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