Hola,
Are you new here?

EuroCIS

financed

Platform for European CMOS Imagers EUROCIS

The main goal of this project is the creation of a European supply chain for state-of-the art CMOS imagers. As identified by both ESA and the EC, there is a need for such a supply chain for CMOS imagers for space applications whi... see more

31/10/2014

IMEC

3M€

Project Budget: 3M€

Project leader

INTERUNIVERSITAIR MICROELECTRONICA CENTRUM No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

Ver 5 Participantes

Financing granted El organismo FP7 notifico la concesión del proyecto The day 2014-10-31 We do not have the information of the call

0% 68% 100%

characteristics of the participant

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Private Information

No hay información privada compartida para este proyecto. Habla con el coordinador.

5 Participantes

IMEC

0.00€ | Leader

LASER SYSTEMS & SOLUTIONS OF...

N.D. | participant

NETHERLANDS ORGANISATION FOR...

N.D. | participant

SES

N.D. | participant

Conecta tu I+D

¿Tienes un proyecto y buscas un partner? Gracias a nuestro motor inteligente podemos recomendarte los mejores socios y ponerte en contacto con ellos. Te lo explicamos en este video

Project leader

INTERUNIVERSITAIR MICROELECTRONICA CENTRUM No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 3M€

participation deadline Sin fecha límite de participación.

Project description The main goal of this project is the creation of a European supply chain for state-of-the art CMOS imagers. As identified by both ESA and the EC, there is a need for such a supply chain for CMOS imagers for space applications which uses solely European (and hence ITAR-free) sources. This goal will be realized using the proposed consortium as all partners have excellent know-how and track record in the expertise fields required. A second goal of the project is to push the performance of CMOS imagers and match the requirements for the (typically very demanding) space applications. Hence large area (much larger than commercial imagers) high sensitivity imagers will be developed using stitching technology and backside thinning. A key element here is the backside passivation process using laser annealing. The outcome of this project is a CMOS imager design and manufacturing platform that can be used by the space industry (ESA, CNES, satellite manufacturers, ... ) for their future space imager needs. However, it will as well serve (and will be open for) other high-end imager needs in e.g. medical or security applications.

Conecta tu I+D

Entra hoy

Forgot your password?

Financing

Companies

CTIs/Universidades

Projects

researchers