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PUNCH

Financiado

Packaging of novel Ultra-dyNamiC pHotonic switches and transceivers for integrat...

Packaging of novel Ultra-dyNamiC pHotonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems PUNCH offers a solution for time-deterministic and time-sensitive networks by developing a new optical switching paradigm which (I) breaks the trade-off between flexibility (ultra-dynamic reconfigurability) and determinism (guaran... ver más

31/08/2026

IMEC

5M€

Presupuesto del proyecto: 5M€

Líder del proyecto

INTERUNIVERSITAIR MICROELECTRONICA CENTRUM No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Ver 8 Participantes

Financiación concedida El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2022-06-23

HORIZON-CL4-2021-DIGITAL-EMERGING-01-06: Advanced optical communication comp... Expected Outcome:Proposal results are expected to contribute to the following expected outcomes:

I+D +1

Cerrada hace 3 años

0% 86% 100%

8 Participantes

IMEC

1.82M€ | Lider

THE CHANCELLOR MASTERS AND S...

N.D. | Participante

AT&S

331.72K€ | Participante

Fraunhofer

801.88K€ | Participante

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Duración del proyecto: 50 meses Fecha Inicio: 2022-06-23
Fecha Fin: 2026-08-31

Líder del proyecto

INTERUNIVERSITAIR MICROELECTRONICA CENTRUM No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 5M€

Descripción del proyecto PUNCH offers a solution for time-deterministic and time-sensitive networks by developing a new optical switching paradigm which (I) breaks the trade-off between flexibility (ultra-dynamic reconfigurability) and determinism (guaranteed latency and jitter) by offering an all-to-all reconfigurable interconnect; (II) reduces congestion by activating bandwidth steering so that additional capacity can be allocated between hot nodes in the network; (III) provides unparalleled dynamics and bandwidth efficiency by further enabling multiplexing in the time domain with fast reconfigurable capability. A 2×2×8Lambda wavelength selective switching element will be scaled to a fully non-blocking 8x8x8Lambda and 16x16x8Lambda reconfigurable optical switch fabric. The development of a III-V foundry process for micro-transfer-printing-compatible semiconductor optical amplifiers enables loss-less optical switching on a silicon photonics platform. Custom configuration electronic ICs to actuate, control, and power-monitor a scaled switch fabric will be densely integrated with the photonic ICs into a heterogeneous fanout wafer-level package, processed on a 200mm reconstructed wafer platform. In addition, the optical interfacing to the photonic ICs will be accomplished using an optical redistribution layer, providing an optical fanout on high-density organic substrates, and allowing for a scalable optical fiber packaging solution. The novel integration and packaging processes will be applied for manufacturing 1.6 Tbit/s optical transceivers providing the interface between optical switches and electronic resources (compute, memory, and storage). The optical switch and transceiver prototypes will be demonstrated in a 5G RAN Transport Network, for TSN Fronthaul applications and for memory disaggregation in data centers.

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