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NanoWelds

Financiado

Cerrado

NanoWelds First nanotechnology for the electronic industry based on a room tempe...

NanoWelds First nanotechnology for the electronic industry based on a room temperature welding process NanoWired GmbH is a high-tech startup that aims to introduce a completely new bonding process for the assembly and manufacturing of electronics. Our patented nanotechnology has been successfully scaled-up and now it is getting rea... ver más

30/04/2021

NANOWIRED GMBH

3M€

Presupuesto del proyecto: 3M€

Líder del proyecto

NANOWIRED GMBH No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 5 Participantes

Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2021-04-30

EIC-SMEInst-2018-2020: SME instrument

I+D

Cerrada hace 5 años

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Características del participante

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

5 Participantes

NANOWIRED GMBH

2.10M€ | Lider

SIRO AGUILAR

371.40K€ | Participante

Lozano, S.A.

230.79K€ | Participante

GENERAL AGROPECUARIA ACOR S....

338.94K€ | Participante

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Duración del proyecto: 30 meses Fecha Inicio: 2018-10-25
Fecha Fin: 2021-04-30

Líder del proyecto

NANOWIRED GMBH No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 3M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto NanoWired GmbH is a high-tech startup that aims to introduce a completely new bonding process for the assembly and manufacturing of electronics. Our patented nanotechnology has been successfully scaled-up and now it is getting ready for its integration in real applications and manufacturing environments. In a record time since the creation of the company in 2017, we have achieved 19 pilot contracts with international giants. Electronics manufacturers face technical challenges that are slowing the rate of performance increases and size reductions. Trying to go 3D (stacking microchips vertically) or using flexible PCB’s are some of the new strategies in the semiconductor and microelectronic industry. However, going 3D is bringing challenges at the micro-level (e.g. the tighter density requires better heat dissipation) and at industrial level (e.g. high yields and scalability, cost-reductions, big investments in equipment, and difficult integration). NanoWired GmbH has developed a process that enables the joining and contacting of electronic components at room temperature. The prepared components simply have to be pressed together, like a metallic Velcro. The result is a permanently solid, strong, flexible and highly conductive connection. With this Phase 2, we will launch the equipment that will push the chip and electronic industry one step beyond by overcoming current limitations of soldering, bonding or gluing techniques. The market launch of NanoWelds represents the beginning of our sales activity planned for the second half of 2020. Three years after market launch, we will reach annual sales of 15.8M€ and an EBT of 14.89M€. Considering these projections and the investment needed for Phase 2 (approx. 3M€), the Return of Investment will be 3,96. Furthermore, with the support of the SME Instrument NanoWired GmbH will grow from 10 to 30 employees in the next five years.

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