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NAVOLCHI

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Nano Scale Disruptive Silicon Plasmonic Platform for Chip to Chip Interconnectio...

Nano Scale Disruptive Silicon Plasmonic Platform for Chip to Chip Interconnection The NAVOLCHI project explores, develops and demonstrates a novel nano-scale plasmonic chip-to-chip and system-in-package interconnection platform to overcome the bandwidth, foot-print and power consumption limitations of todays el... see more

31/07/2015

KIT

3M€

Project Budget: 3M€

Project leader

KARLSRUHER INSTITUT FUER TECHNOLOGIE No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

Ver 8 Participantes

Financing granted El organismo FP7 notifico la concesión del proyecto The day 2015-07-31 We do not have the information of the call

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characteristics of the participant

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Private Information

No hay información privada compartida para este proyecto. Habla con el coordinador.

8 Participantes

KIT

0.00€ | Leader

STMICROELECTRONICS SRL

N.D. | participant

ETH Zürich

N.D. | participant

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Project leader

KARLSRUHER INSTITUT FUER TECHNOLOGIE No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 3M€

participation deadline Sin fecha límite de participación.

Project description The NAVOLCHI project explores, develops and demonstrates a novel nano-scale plasmonic chip-to-chip and system-in-package interconnection platform to overcome the bandwidth, foot-print and power consumption limitations of todays electrical and optical interconnect solutions. The technology exploits the ultra-compact dimensions and fast electronic interaction times offered by surface plasmon polaritons to build plasmonic transceivers with a few square-micron footprints and speeds only limited by the RC constants. Key elements developed in this project are monolithically integrated plasmonic lasers, modulators, amplifiers and detectors on a CMOS platform. The transceivers will be interconnected by free space and fiber connect schemes. The plasmonic transceiver concept aims at overcoming the challenges posed by the need for massive parallel interchip communications. Yet, it is more fundamental as the availability of cheap miniturized transmitters and detectors on a single chip will enable new applications in sensing, biomedical testing and many other fields where masses of lasers and detectors are need to e.g. analyze samples. Economically, the suggested technology is a viable approach for a massive monolithic integration of optoelectronic functions on Si substrates as it relies to the most part on the standardized processes offered by the silicon industry. In addition, the design and production cost of plasmonic devices are extremely low and with the dimension 100 times smaller over conventional devices they will require much lower energy to transfer data over short ranges of multi-processor cluster systems. The project is disruptive and challenging but it is clearly within the area of expertise of the consortium. It actually builds on the partners prior art such as demonstration of the first nano-scale plasmonic pillar laser. This project has the potential to create novel high-impact technologies by taking advantage of the manifold possibilities offered by plasmonic effects.

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