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MycoSub

Financiado

Mycelium-based substrate for sustainable flexible PCBs

Printed circuit boards are an indispensable technology present in all classes of modern electronics. Their flexible embodiments (flexPCBs) enable current and emerging form factors and drive the transition to human-centered applica... ver más

31/07/2025

JOHANNES KEPLER UN...

150K€

Presupuesto del proyecto: 150K€

Líder del proyecto

UNIVERSITAT LINZ No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Financiación concedida El organismo HORIZON EUROPE notifico la concesión del proyecto el día 2024-01-24

ERC-2023-POC: ERC PROOF OF CONCEPT GRANTS Objective:Objectives:The ERC Proof of Concept Grants aim at facilitating exploration of the commerci...

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Duración del proyecto: 18 meses Fecha Inicio: 2024-01-24
Fecha Fin: 2025-07-31

Líder del proyecto

UNIVERSITAT LINZ No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 150K€

Descripción del proyecto Printed circuit boards are an indispensable technology present in all classes of modern electronics. Their flexible embodiments (flexPCBs) enable current and emerging form factors and drive the transition to human-centered applications. At the same time, PCBs are notoriously difficult to recycle and contribute majorly to the growth of electronic waste and an unsustainable use of resources. A paradigm change towards bioderived and biodegradable materials promises a remedy, however so far, no viable solution for sustainable (flex)PCBs exists. MycoSub takes on an entirely new approach of growing and refining fungal mycelium skins as environmentally friendly and entirely biodegradable, yet high performance substrate material for the manufacturing of flexPCBs. Building upon MycelioTronics, the first mycelium-based electronic circuits, we here aim at developing an industry-compatible process flow that seamlessly merges into established commercial procedures for rapid adoption of the technology. With facile post-processing steps that do not impede biodegradability, we will achieve a competitive flexible circuit board substrate with high thermal stability, high flexibility and low surface roughness. We aim to develop both conventional subtractive (etching) as well as fully sustainable additive manufacturing techniques for low-conductivity, soldering-compatible conducting traces. Such MycoSub-flexPCBs will ultimately provide unprecedented levels of sustainability through the combination of a biodegradable yet resilient substrate with efficient waste-minimizing, energy-saving workflows and re-use strategies for precious metals and electronic components. These endeavors will be accompanied by thorough material characterization, ensuring that MycoSub materials live up to the high requirements of the industry. Ultimately, MycoSub-flexPCB demoboards will showcase the potential of sustainable solutions for the broad ecosystem of flexible electronics.

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