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ROBIN

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Multi Gigabit Scalable Energy Efficient on board Digital Processors Employing...

Multi Gigabit Scalable Energy Efficient on board Digital Processors Employing Multi core Vertical Embedded Opto electronic Engines New multi-beam Tera-scale capacity satellites will require a disruptive approach to address digital on-board processors that rely on electronics which consume space, power and cost and reach their capacity saturation. The disrupti... ver más

02/06/2017

GOOCH HOUSEGO TOR...

4M€

Presupuesto del proyecto: 4M€

Líder del proyecto

GOOCH HOUSEGO TORQUAY LIMITED No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 8 Participantes

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2017-06-02 No tenemos la información de la convocatoria

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No hay información privada compartida para este proyecto. Habla con el coordinador.

8 Participantes

GOOCH HOUSEGO TORQUAY LIMIT...

0.00€ | Lider

THALES ALENIA SPACE FRANCE

N.D. | Participante

Philips GmbH

N.D. | Participante

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Líder del proyecto

GOOCH HOUSEGO TORQUAY LIMITED No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 4M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto New multi-beam Tera-scale capacity satellites will require a disruptive approach to address digital on-board processors that rely on electronics which consume space, power and cost and reach their capacity saturation. The disruptive solution must combine scalability, technical feasibility, power-efficiency and cost-effectiveness. ROBIN aims to provide this solution realizing multi-gigabit optical inter-connectivity with a unique combination of low-power and high-bandwidth multimode (MM) GaAs VCSEL/PDs, low power, radiation-hardened BiCMOS drivers and radiation-hardened multi-core fibers (MCFs). ROBIN will integrate these technologies on a space grade photonic integration capable to provide ruggedized transceiver modules with a record-high 150Gb/s throughput and 6mW/ Gb/s energy consumption which is a 3-fold improvement against state-of-the-art (SOTA) US-based products. ROBIN will fabricate the first >15GHz MCF-matched 850nm VCSELs operating at -40 to +100 oC and will drive energy consumption down to <200 fJ/bit (0.2 mW/Gb/s). ROBIN will demonstrate the first >30 GHz MM MCF-PDs with >0.6A/W responsivity. ROBIN will couple MCF-VCSELs/PDs to the first 6-core radiation-hard MM-MCF to offer the capability for single-feedthrough robust and hermetic module packaging. Fibers will be distributed through a monolithic fan-out avoiding the use and procurement of expensive connectors. ROBIN will develop the first 25 Gb/s 6-channel, driver/TIA ICs with record-low <2pJ/bit energy consumption in a 5-fold decrease against SOTA products. ICs will be fabricated with IHP 0.25μm SiGe BiCMOS process which is under ESA qualification. ROBIN will fabricate an opto-electronic 6x25 Gb/s capable ADC/DAC module using MCF optical interfaces and will test it in a full-scale optical interconnect breadboard demonstrator. Finally, ROBIN will perform space assessment tests on all the components to align development towards a European space qualifiable system.

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