MIWA creates a complex and highly scalable ecosystem of Smart Reusable Packaging, built as an integrated hardware and software solution, with embedded IoT elements, connected to a vast digital environment and powered by advanced d...
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RECYSMART
SMART CONTAINER AND BIG DATA PLATFORM TO INCREASE PACKAGING...
71K€
Cerrado
Duración del proyecto: 17 meses
Fecha Inicio: 2022-08-31
Fecha Fin: 2024-02-29
Líder del proyecto
MIWA TECHNOLOGIES AS
No se ha especificado una descripción o un objeto social para esta compañía.
Presupuesto del proyecto
4M€
Fecha límite de participación
Sin fecha límite de participación.
Descripción del proyecto
MIWA creates a complex and highly scalable ecosystem of Smart Reusable Packaging, built as an integrated hardware and software solution, with embedded IoT elements, connected to a vast digital environment and powered by advanced data analytics. MIWA reusable packaging carries the goods as well as data, working in tandem with unique electronic dispensers placed in retail and our digital platform operating in the Cloud. The data flows throughout the entire value chain thanks to IoT modules embedded in MIWA’s hardware, offering substantial opportunities to all stakeholders involved to enhance efficiency, product & consumer safety and outperform the effects of the current single-use dominant approach. Life Cycle assessment study proves that MIWA can reduce overall negative environmental footprint of packaging by 71%, reflecting on several factors: packaging waste reduction, eco-toxicity, fossil feedstock, water consumption and climate change impact.